HP-00007-01, Appendix 3 13-Oct-2004
Page 2
Components, parts and materials
containing radioactive substances
0
2.0 Tools
Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if applicable)
Screwdriver
Type-Phillip #1
Screwdriver Type-Phillip
#0
Screwdriver
Type-T #8
3.0 Product
Disassembly
Process
3.1
List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1
Remove 6 cell battery
2
Remove M2.5*6L screws on HDD door, then remove HDD and ODD module.
3
Remove M2.5*6L screws and M2*3L screws on lower case , then reverse it.
4
Remove middle cover assy., then remove M2*3L screws on upper case.
5
Remove keyboard and LCD assy.
6
Remove M2*12L screws and M2*3L screws on upper case.
7
Remove upper case assy.
8
Remove M2.5*6L screws, then remove MB.
9
Remove IO/R and lower case assy.
10
Divide MB from connecter and Remove RTC coin cell battery on MB for selective
treatment.
11
Remove six M2.5*6L screws, then remove LCD bezel
12
Remove two M2.5*5L screws, then remove daughter board and LCD module.
13
Remove four M2*2L screws on middle cover assy., then Remove launch board.
14
Disassemble LCD assembly and remove mercury bulb for selective treatment.
3.2
OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below:
