HP-00007-01, Appendix 3 13-Oct-2004
Page 2
Components, parts and materials
containing radioactive substances
0
2.0 Tools
Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if applicable)
Screwdriver
Type-cross #1
Screwdriver Type-cross
#0
Screwdriver
Type-T #8
3.0 Product
Disassembly
Process
List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1
Remove 8 or 12 cell main battery.
2
Remove two M2.5*6L screws on HDD door and HDD, then remove two M2.5*6L and HDD
module.
3
Remove one M2.5*6L screws on lower case, then remove ODD module.
4
Remove four M2.5*14L screws on logic lower and then remove keyboard cover.
5
Remove two M2.5*6L and four M2.5*6L screws, then remove LCD module
6
Remove four M2.5*3L then remove keyboard.
7
Reverse it back and remove eleven M2.5*14L screws and five M2.5*6L screws on logic
lower then disassemble logic lower.
8
Remove four spring screws on thermal module, then remove thermal module on M/B.
9
Remove seven M2.5*6L screws, then remove thermal frame.
10
Remove four M2.5*6L screws, remove M/B.
11
Remove RTC coin cell battery on M/B for selective treatment
12
Remove two M2.5*4L on audio board, then remove audio board.
13
Remove six M2.5*4L screws on trackpad board, then remove trackpad module.
14
Remove four M2.5*6L screws on LCD module, then disassemble LCD bezel from LCD
module, then remove LCD module.
15
Remove mercury bulb from LCD assy for selective treatment
3.2
OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below:
