HP-00007-01, Appendix 3 13-Oct-2004
Page 2
Components, parts and materials
containing radioactive substances
0
2.0 Tools
Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if applicable)
Screwdriver
Type-cross #1
(JIS B 4633-1987)
3.0 Product
Disassembly
Process
3.1
List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1
Remove 6 or 12 cell main battery from system bottom.
2
Remove two M2.5*5L screws on HDD door, then remove HDD.
3
Remove a M2.5*6L screw on BASE cover, then remove ODD.
4
Remove three M2.5*5L screws on BASE cover, then remove RAM door and MINIPCI
door.
5
Remove two M2.5*4L screws to remove the keyboard cover.
6
Remove three M2.5*3L and one M2.5*6L screws to remove the keyboard and release out
the T/P module FFC.
7
Remove two M2.5*6L screws to remove the led board.
8
Remove four M2.5*6L screws, then remove LCD assy.
9
Remove five M2.5*6L, three M2.5*4L screws on top side and seven M2.5*6L, five
M2.5*15L, six M2.5*4L screws on bottom side to remove base cover and speaker box.
10
Remove two M2.5*4L screw and then remove daughter board.
11
Remove two M2.5*4L screws and then remove the battery board.
12
Remove two M2.5*4L screws and then remove the DC board.
13
Remove three M2.5*4L screws and then remove MB
14
Remove four M2.0 spring screw and one M2.5*4L screw and then remove thermal
module.
15
Remove six M2.5*5L screws and then remove LCD bezel.
16
Remove six M2.5*5L and four M2*3L screws to remove LCD panel and inverter board.
17
Divide from connecter and remove RTC coin cell battery on MB for selective treatment
18
Disassemble LCD panel and remove mercury bulb for selective treatment.
