EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available atComponents, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
1.3 Markings for plastic parts greater than 25 grams
Plastic Part Name
Plastic Part
Description
Weight (grams)
ISO 11469:2000 Plastic
Part Mark
Optional:
Photo
Mars2_MAIN_BEZEL_FRAME
bezel frame
171 ABS
Mars2_TRIM_BEZEL_BOTTOM bezel bottom
123 ABS
Fan Frame
CPU fan frame
35 >PBT-GF30-FR(17)<
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 T15 screw driver
Φ
5
Description #2 Philips screw driver
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove cover from the unit
2. Take off Front Panel
3. Take PCI & PCI-E cards off the PCA
4. Take off ODD
5. Take off Cooler
6. Take off CMOS battery
7. Take off PS from the Unit
8. cut off wire tie
9. open PS
10. Tool list
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
