HP Compaq LE1851wl, Disassembly Instructions Manual

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EL-MF877-00 Page 2
Template Revision A
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 SCREW DRIVER(PHILLIPS HEAD) #2
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Take off the screws of stand
，
and remove the stand
2. Take off the screws of rear cover
，
remove the rear cover
3. Pull out the pin of lamp
4. Pull out the pin of KEPC cable
5. Remove Bezel
6. Pull out the PIN of LVDS cabel
7. Take off the Power board screws
8. Take off the VGA screws
9. Tear off the adhesive tape;pull out the connector PIN which connect PWPC and Main board
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).