EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at
Item Description
Notes
Quantity of
items
included in
product
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw Driver
#1
Tweezer
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1.
Removing screw cap mylar and base rubber feet on upper side
2.
Removing base case
3.
Removing panel cable / Wlan cable and hinge up assembly
4.
Removing battery
5.
Removing Touch Pad module
6.
Removing Wlan module / USB board / Main board / SPK
7.
Removing Bezel sub assembly
8.
Removing hinge w/ hinge cap
9.
Removing camera module / Wlan cable
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
