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EL-MF877-00                                                                                                Page  1 
Template Revision C  

Last revalidation date 09-May-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

                  

Product End-of-Life Disassembly Instructions 

Product Category: Notebooks and Tablet PCs

 

Marketing Name / Model 
[List multiple models if applicable.] 

HP Chromebook x360 14b 

 

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the 

disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). 
 
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the 
plastic part. For any questions on plastic marking, please contact 

HP’s Sustainability Contact

.    

1.0

 

Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. 

Item Description 

Notes 

Quantity of 
items 
included in 
product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 
Main board, Touch board, USB board, TP board, sensor 
board, camera module 

Batteries, excluding Li-Ion batteries. 

All types including standard alkaline, coin or button style 
batteries  Main Battery 

 

Li-Ion batteries.  Include all Li-Ion batteries if more than 
one is provided with the product (such as a detachable 
notebook keyboard battery, RTC coin cell, etc.) 

Battery(ies) are attached to the product by (

check all 

that apply with an

 

“x” 

inside the

 

“[ ]”):

 

[x] screws 
[] snaps 
[] adhesive 
[] other.  Explain            
NOTE: Add detailed removal procedures including 
required tools in the sections 3.1 and 3.2. 

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

           

Liquid Crystal Displays (LCD) with a surface greater than 
100 sq cm 

Includes background illuminated displays with gas 
discharge lamps  Touch Panel 

Cathode Ray Tubes (CRT) 

            

           

Capacitors / condensers (Containing PCB/PCT) 

            

           

Electrolytic Capacitors / Condensers measuring greater 
than 2.5 cm in diameter or height 

            

           

External electrical cables and cords 

 DC Cable for External Power Supply 
 External power code 

Summary of Contents for Chromebook x360 14b

Page 1: ...e right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm Main board Touch board USB board TP board sensor board camera module 6 Batteries excluding Li Ion batteries All types including standard alkaline coin or button style batteries Main Battery Li Ion batteries Inclu...

Page 2: ...ypically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed Tool Description Tool Size if applicable Screw Driver 1 Tweezer 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the extern...

Page 3: ...00 Page 3 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 1 Removing screw cap Mylar and base rubber feet on upper side 2 Removing base case ...

Page 4: ...877 00 Page 4 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 3 Removing panel cable Wlan cable and hinge up assembly 4 Removing battery ...

Page 5: ...77 00 Page 5 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 5 Removing Touch Pad module 6 Removing Wlan module USB board Main board SPK ...

Page 6: ...EL MF877 00 Page 6 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 7 Removing Bezel sub assembly 8 Removing hinge w hinge cap ...

Page 7: ...EL MF877 00 Page 7 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 9 Removing camera module Wlan cable ...

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