EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw Driver
#1
Description #2 Screw Driver
#2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. separate the machine into two parts : slate and chassis
2. use jig to separate glass assy and cover assy
3. pull out touch control board , touch fpc , LVDS cable
4. remove battery screw*5 , pull out battery cable
5. remove mb support metal screw*3 , speaker L screw*2 , MB screw*1 , wi-lan card screw*1
6. pull out mb support metal , speaker L ,MB sub-assy,wi-lan module
7. remove antenna R/L screw*4 , antenna module,front camera,rear camera,rear mic fpc , front mic fpc
8. remove speaker R screw*2 , usb bkt screw*2 ,volume button , usb board ,usb fpc , usb bkt,speaker R
9. remove pogo-pin fpc screw*2,audio-jack fpc screw*1 , power btn,power board,audio-jack fpc,pogo-pin fpc
10. remove base rubber, base screw*4, base assy
11. remove tp support bkt screw*3 , tp holder screw*3 , tp support bkt , tp holder bkt, pull out tp ffc ,
12. remove hinge screw*4 , hinge cover, hinge bar,pull out pogo-pin cable
13. remove docking board screw*2 , pogo-pin board screw*1 , pogo-pin board ,docking board , pull out docking ffc
14. remove hinge bar mylar , hinge bar screw*6 , hinge bar up , hinge screw*4 , hinge R/L ,pogo-pin cable
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Separate the machine into two parts : slate and chassis
3.22 Separate glass assy and cover assy
