EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at
EL-MF877-01
Item Description
Notes
Quantity of
items
included in
product
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
#0
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1.
Remove Rubber foot x2 from D base
2.
Remove screw from D base x 7pcs M2.5L6 & 2pcs M2.5L8.5
3.
Remove C top sub-Assy from unit
4.
Remove TP support bracket & TP module from C top sub-Assy
5.
Remove Bezel & panel & Cover from LCD sub-Assy
6.
Remove camera module & camera cable & LVDS cable & antenna cable
7.
Remove L/R Hinge
8.
Remove Speaker module
9.
Remove D/B & M/B bracket
10.
Remove D/B & M/B FFC
11.
Remove D/B & M/B &hall sense /B & WLAN card cable
12.
Remove thermal plate from M/B
13.
Remove battery pack x 4 pcs M2L3.5
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
1.
Total part disassembly
