MF877-00 Page 3 Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
MF877-01
Page 1: ...lassified as requiring selective treatment 1 2 Enter the quantity of items contained within the product which require selective treatment in the right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 1 Batteries All types including standard alkaline and lithium coin or...
Page 2: ...tment can be removed Tool Description Tool Size if applicable Torx Screwdriver T10 Phillips Screwdriver 1 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment 1 Unscrew 7x T10 screws for top cover 2 Slide top cover backward from the faceplate to open the cover 3 Unscrew 17x screws securing Main P...
Page 3: ...MF877 00 Page 3 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 ...
Page 4: ...MF877 00 Page 4 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 ...
