EL-MF877-00 Page 2
Template Revision A
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1:Crossing Screwdriver
#1
Description #2:Bushing Screwdriver
(HEX5.5MM)
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the Monitor on the desk, Unlock the 2 screws which used to fix the stand with backcover
2. Take out the bezel with hand..
3. Take out the keypad PCBA with Screw Driver
4. Take out the backcover with hand.Then take out theTape and Foil with hand.
5. Unlock the 4 screws which used to fix the panel with Chassis
6. Take out the LED light conector,then remove the FFC connector from Panel.
7. Sperate chassis assembly and panel,remove the FFC wire from PCBA
8. Unlock the 4 screws which fix the IF board to the chassis,unlock the 2 screws which fix power socket to the chassis
9. Remove theUSB braket,Unlock the 3 screws,Unlock the 7screws which fix the IF & Power PCBA
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. 2311gt monitors System disassembly methods:
2. 2311gt LGD Panel (LM230WF8-TLA3) disassembly methods: