M-93
GPS Module series
THE PRO NAME IN GPS
HOLUX Technology, Inc.
No.1-1, Innovation Rd.1, Hsinchu Science Park, Hsinchu, Taiwan(R.O.C)
TEL: 886-3-6687000 FAX:886-3-6687111 E-mail:[email protected] http:www.holux.com.tw
3
Index
1.
Introduction
.............................................................................................4
1.1.
General introductions
..................................................................4
1.2.
Key Features
................................................................................4
1.3.
Applications
.................................................................................4
2.
Technical Description
.............................................................................5
2.1.
Block Diagram
..............................................................................5
2.2.
Pin Definition
................................................................................5
2.3.
Specification
.................................................................................7
3.
Mechanical Dimension
...........................................................................9
3.1
Mechanical Dimension
................................................................9
4.
Package
.................................................................................................10
4.1.
Packing
.......................................................................................10
5.
User Interface
........................................................................................ 11
5.1
NMEA Protocol
........................................................................... 11
5.2
NMEA Protocol format
............................................................... 11
5.3
MTK NMEA Packet Format
........................................................12
6.
Reference design
..................................................................................13
6.1
Reference circuit
........................................................................13
6.2
Reference PCB pattern
..............................................................14
6.3
Recommend PCB Footprint
......................................................15
6.4
Recommendation reflow profile
................................................16
