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12
Doc. no. : HTMF_Kor_2016, Rev. 0
Issued date : 2016. 11
HITROL Co., Ltd
7 years, and has electronic components that are easily available in the market.
1.4.1
The F/E comprises an Sr and Sas of which the number depends on the number
of lines.
1.4.1.1
The Sr, which comprises an RTD, measures temperature of the fluid.
1.4.1.2
Each Sa, which comprises an RTD and a heater, measures temperatures
higher than the fluid temperature.
1.4.2
The F/T comprises a base, a power, an input, a main, and an output board.
1.4.2.1
Base Board: This board has connectors for the other boards and a terminal
block for connecting external cables.
1.4.2.2
Power Board:
This board supplies DC power to the components at constant
voltages and at constant currents.
1.4.2.3
Input Board:
This board receives data from the F/E, carries our A/D conversion,
and transmits the converted data to the main board for facilitating calculation by
the microprocessor.
1.4.2.4
Main Board:
This board receives data from the input boards, calculates the data,
and sends them to the output board.
1.4.2.5
Output Board: This board receives digital data from the main board, and
converts them to analog data (4
–
20 mA) for transmitting them outside the
F/T.
2. Test preparations
2.1
HTMF-MF, 1 set
2.2
Multimeter, 1 EA: for checking output (4–20 mA)
2.3
Simulator, 2 EA: decade resistance box (1,000–1,500 Ω)
2.4
Performance test report: on test data of the F/E
3. Wiring for Functional Test
3.1
For wiring, refer to the attached wiring diagram.
3.2
For wiring of the F/E and the F/T of the thermal dispersion
–
type F/M, use cables that
conform to product specifications of our company. For wiring, it is preferable to use single-
strand cables between the F/E and the F/T. In addition, special care should be taken in case
cables are joined midway.
3.3
For the cable connecting to the F/E, use core conforming to the specifications of our
company to minimize noise of the signal line by mitigating EMI, etc.
