A
BOUT
THE
S
YSTEM
I
NTRODUCTION
1
1.1 Introduction
This document provides an overview of the hardware features of the chassis,
troubleshooting information, and instructions on how to add and replace components of
the server.
System Features
The system comprises a 1U/30.7” long chassis. Major features include:
Chipset
: Intel
®
C624
Processors (x2)
: Intel® Xeon® Processor Scalable Family (codename Skylake-SP)
Expansion:
See
SKU information
on page
3
for more information.
Memory:
Up to 24 DIMM slots are available; ECC DDR4 2666 MT/s RDIMM memory
Network*:
Dedicated GbE management NIC port from PHY RTL8211 to BMC
Intel® C624 as 2x or 4x 10GbE integrated network solution with PHY (optional)*
*The dual port or quad port PHY card is installed to OCP mezzanine slot
Specifications
Note:
The system supports: 500W and 800W Titanium/Platinum redundant PSU, 100-240VAC 50/
60Hz, AC/ HVDC; 1100W redundant DC PSU: Acbe I/P: DC -39 - - 72v, 37A max.
Table 1.1: System Specifications
S
PECIFICATIONS
D
ESCRIPTION
Form factor
1U rack mount
Chassis dimensions
(W x H x D)
440mm x 43.2 mm x 780 mm
17.3" x 1.7" x 30.7"
Processor
Processor type:
Intel® Xeon® Processor Scalable Family (codename Skylake-SP)
Max. TDP support:
165W, Optimized power delivery for 85W, VRD 13
Number of processors:
2
Internal Interconnect:
10.4 GT/s, 9.6 GT/s
Chipset
Intel
®
C624
Memory
Total slots:
24
Memory type:
DDR4 2666 MT/s RDIMM
Memory size:
8GB, 16GB, 32 GB*
*More options refer to the AVL
