MYK2011_100 Low Power Wi-Fi Module User Manual
Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com)
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TABLE OF CONTENTS
LIST OF FIGURES ................................................................................................................................... 3
LIST OF TABLES .................................................................................................................................... 4
1.
PRODUCT OVERVIEW ................................................................................................................ 5
1.1.
General Description ................................................................................................................. 5
1.1.1
Device Features .................................................................................................................. 5
1.1.2
Device Paremeters ............................................................................................................. 6
1.1.3
Key Application ................................................................................................................... 6
1.2.
Hardware Introduction ............................................................................................................. 7
1.2.1.
Pins Definition ..................................................................................................................... 7
1.2.2.
Electrical Characteristics .................................................................................................... 9
1.2.3.
Mechanical Size ................................................................................................................ 11
1.2.4.
External Antenna .............................................................................................................. 11
2.
PACKAGE INFORMATION ........................................................................................................ 13
2.1.
Recommended Reflow Profile .............................................................................................. 13
2.2.
Device Handling Instruction (Module IC SMT Preparation) ............................................... 13
2.3.
Shipping Information ............................................................................................................. 13
3.
OEM/INTEGRATORS INSTALLATION MANUAL .................................................................. 15
