Rotation: You can rotate the arm of the L-shaped structure by loosening the
knob located to the left of the handpiece.
3.
Fine adjustment
X-axis adjustment: The rearward knob in the back righthand corner will move the
rails that hold the PCB board along the x-axis (left or right).
Y-axis adjustment: The knob closest to you in the bottom leftmost corner will
move the entire L-shaped structure along the
y-axis (towards or away from you).
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Counterclockwise will move it further from you.
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Clockwise will move it towards you.
4.
Double check
The pad should be directly above the area where you wish to add/remove a
component.
How to Remove Components
1.
Placement of PCB board
The nozzle and pad should be directly above, but barely above, the part to be
removed (a separation of 2 millimeters give or take). More detailed instructions
can be found above.
2.
Heating
Turn on the Hakko station (the blue box) by pressing the power button on the
left. Make sure it is plugged in.
Press the “S” button in the lower right hand corner to begin heating.
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Note: the nozzle and pad should already be centered on the piece you
want to remove!
Press the “S” button to turn heating off when the solder in that area appears
melted.
3.
Part removal
Rotate the yellow knob on the handpiece so that the pad is just barely poking
out of the nozzle.
Turn on the vacuum by pressing the “V” button on the Hakko station (it is next to
the “S” button). You can check that it is on by placing your finger under the pad.
You should feel suction.
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Note that there are different nozzle sizes and pad sizes. The larger the
piece you want to remove, the larger the nozzle and pad you use.
The vacuum should suction up the part. If it is not working, check to see that
enough heat has been applied so that the surrounding solder has melted.
4.
Releasing the removed part
