5. OPERATION
(Continued)
(3) Cleaning
Cleaning is extremely important and should be done frequently during the desoldering process.
Parts should be checked periodically for wear and should be replaced if necessary. See the
MAINTENANCE section of these instructions.
• Clean the nozzle as you would clean a soldering tip: wipe away any excess solder with a
sponge moistened with de-ionized or distilled water, or using a wire tip cleaner.
Before putting the desoldering tool away, apply a new coat of solder on the tip.
• Using a cleaning pin that matches the diameter of the nozzle, clean the inside of the nozzle
opening. This must be done while the nozzle and heating core are still hot, so be careful.
• Discard any solder that has collected in the filter pipe. Do this carefully, as the solder will
still be extremely hot.
• Replace the filter. See the MAINTENANCE section of these instructions.
The ceramic paper filter (L) should be replaced immediately when a stain appears or vacuum
decreases. Failure to do this will reduce the performance of the pump and may damage it.
● Cleaning with cleaning pin
● Cleaning with cleaning drill
● Clean the heating core
The cleaning pin passes
completely through the hole.
Rotate the cleaning drill clockwise while inserting,
then pull straight out.
Scrape away all oxidation from the hole in the heating element until
the cleaning pin passes cleanly through the hole.
*Cleaning drill (optional)
The cleaning pin passes cleanly
and completely through the hole.
(4) Temperature setting
The temperature of the HAKKO FR-301 can be adjusted between 350 - 500 °C/660 - 930 °F.
Set the temperature in accordance with the requirements of the job being done. Although the
temperature needed for desoldering cannot be determined merely by the type of board to be
desoldered, the values in the table below may be used as a general guide.
6. MAINTENANCE
The frequency of cleaning and part replacement greatly depends on a variety of factors,
including the temperature at which the desoldering tool is operated, and the types of
solder and flux used. Using the table below as a general guide, clean and replace parts in
accordance with use conditions.
Maintenance
During use
Clean nozzle
Discard solder that has collected
Clean nozzle and heating core
When necessary
Replace parts
Periodically
Clean pump
Low
High
CAUTION
Change the temperature only with the temp. control knob.
Do not use the “CAL” trim pot.
Type of board
Approximate setting (on scale)
Single-sided P.W.B.
1
Through-hole P.W.B.
2
Multilayer P.W.B.
3 to 4
• In general, the greater the temperature, the more quickly the
nozzle will oxidize and wear out.
• As nozzle oxidation and wear increases, the nozzle temperature
will decrease. In such cases, increasing the set temperature
will only accelerate oxidation and hasten wear.
Replace worn nozzles as soon as possible.
