Wireless
Communication
Module
k
AzureWave Wi-Fi AW-CB304NF (Realtek
®
RTL8821CE)
- WIFI 802.11a/b/g/n/ac, supporting 2.4/5 GHz Dual-Band
- BLUETOOTH 4.2
- Support for 11ac wireless standard and up to 433 Mbps data rate
* Actual data rate may vary depending on environment and equipment.
Expansion Slots
1 x PCI Express x16 slot, running at x16
(The PCIEX16 slot conforms to PCI Express 4.0 standard.)
(Note)
2 x PCI Express x1 slots
(The PCIEX1 slot conforms to PCI Express 3.0 standard.)
Storage Interface
CPU:
- 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2
SSD support) (M2P_CPU)
(Note)
Chipset:
- 1 x M.2 connector (Socket 3, M key, type 2260/2280 SATA and PCIe 3.0 x4/
x2 SSD support) (M2A_SB)
- 6 x SATA 6Gb/s connectors
* Refer to "1-7 Internal Connectors," for the installation notices for the M.2 and SATA
connectors.
Intel
®
Optane
™
Memory Ready
* System acceleration with Intel
®
Optane
™
Memory can only be enabled on the M2P_CPU
connector and with an 11th Generation Intel
®
processor installed.
USB
Chipset:
- 1 x USB Type-C
®
port on the back panel, with USB 3.2 Gen 1 support
- 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through
the internal USB header)
- 4 x USB 2.0/1.1 ports available through the internal USB headers
USB 2.0 Hub:
- 2 x USB 2.0/1.1 ports on the back panel
Internal
Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
3 x system fan headers
1 x addressable LED strip header
1 x RGB LED strip header
6 x SATA 6Gb/s connectors
2 x M.2 Socket 3 connectors
1 x front panel header
1 x front panel audio header
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI
2.0 module only)
1 x serial port header
M
1 x parallel port header
M
1 x Clear CMOS jumper
1 x Q-Flash Plus button
(Note) Supported by 11th Generation processors only.
M
Only for the B560M DS3H.
k
Only for the B560M DS3H AC.
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