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BSMI CNS15663
限用物質含有情況標示聲明書
Declara
ti
on of the Presence Condi
ti
on of the Restricted Substances Marking
設備名稱:
M.2 / PCIE SSD Module
型號(型式):
GP-ASACNE6200TTTDA
Equipment name
Type designa
ti
on (Type)
單元
Unit
限用物質及其化學符號
Restricted substances and its chemical symbols
鉛
Lead
(Pb)
汞
Mercury
(Hg)
鎘
Cadmium
(Cd)
六價鉻
Hexavalent
chromium
(Cr
+6
)
多溴聯苯
Polybrominated
biphenyls
(PBB)
多溴二苯醚
Polybrominated
diphenyl ethers
(PBDE)
印刷電路板總成
PCB Assembly
-
○
○
○
○
○
晶片
Chip
○
○
○
○
○
○
散熱片
Heat Sink
○
○
○
○
○
○
連接器
(
設計選配
)
Connectors (Design op
ti
ons)
○
○
○
○
○
○
其他塑膠組件
(
設計選配
)
Other plas
ti
c components
(Design op
ti
ons)
○
○
○
○
○
○
備考
1. "
超出
0.1 wt %"
及
"
超出
0.01 wt %"
係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1 wt %" and "exceeding 0.01 wt %" indicate that the percentage content of the restricted
substance exceeds the reference percentage value of presence condi
ti
on.
備考
2. "
○
"
係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "
○
" indicates that the percentage content of the restricted substance does not exceed the percentage
of reference value of presence.
備考
3. "
-
"
係指該項限用物質為排除項目。
Note 3: The "
-
" indicates that the restricted substance corresponds to the exemp
ti
on.
Summary of Contents for AORUS GP-ASACNE6200TTTDA
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