BGS2-W miniPCIe Hardware Interface Description
3.2 Characteristics
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BGS2-W_miniPCIe_v01.000
Page 17 of 36
2012-10-05
Confidential / Preliminary
The total cable length between the BGS2-W module pads soldered onto the BGS2-W miniPCIe
and the pads of an external SIM card holder must not exceed 100mm in order to meet the spec-
ifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.
To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both
lines are not placed closely next to each other. A useful approach is using a GND line to shield
the CCIO line from the CCCLK line.
As an option it is possible to employ a MFF2 UICC card by soldering the MIM card directly onto
the BGS2-W miniPCIe board. However, simultaneous opertation of soldered on-board MIM
and external SIM/UICC card is not possible, i.e., if using a soldered on-board MIM an external
SIM/UICC card can and should not be used.
3.2.4
Status LED
The BGS2-W miniPCIe provides a status indication line over the 52-pin application connector
specified in
- the LED line.
The line can be configured to drive a status LED which indicates different operating modes of
the module. To take advantage of this function an LED may be connected to the status line as
shown in
.
Figure 5:
Status signalling with LED driver
VCC
Status
LED
LED
GND
GND
R1
R2
R3
