1-3-2
VCRP_SN
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Hot-air
Flat Pack-IC
Desoldering
Machine
CBA
Flat Pack-IC
Tweezers
Masking
Tape
Fig. S-1-2
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
Fine Tip
Soldering Iron
Sharp
Pin
Fig. S-1-4
Summary of Contents for 29D-850
Page 25: ...1 10 3 HK4F8SCM1 Main 1 6 Schematic Diagram...
Page 27: ...1 10 5 HK4F8SCM3 Main 3 6 Schematic Diagram...
Page 28: ...1 10 6 HK4F8SCM4 Main 4 6 Jack Sub Jack Schematic Diagram...
Page 30: ...1 10 8 HK4F8SCM6 Main 6 6 Schematic Diagram...
Page 31: ...1 10 9 HK4F8SCAFV AFV Schematic Diagram...
Page 34: ...1 10 12 Jack CBA Top View Jack CBA Bottom View BHG470F01014C...
Page 41: ...1 15 1 HK4F5FEX EXPLODED VIEWS Front Panel A1X...
Page 53: ...29D 850 HK4F8ED 2005 09 02...
