20030318
3-3-1
HE244EL
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE:
Products marked with a
!
have special characteristics important to safety.
Before replacing any of these components, read care-
fully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTES:
1.
Parts that are not assigned part numbers (---------)
are not available.
2.
Tolerance of Capacitors and Resistors are noted
with the following symbols.
Comparison Chart of Models and Marks
MCV CBA
MAIN CBA
C.....±0.25%
D.....±0.5%
F.....±1%
G.....±2%
J......±5%
K.....±10%
M.....±20%
N.....±30%
Z.....+80/-20%
Model
Mark
27C-250
A
27C-254
B
Ref. No.
Mark
Description
Part No.
A
MCV CBA
0VSA13928
B
MCV CBA
0VSA13931
Consists of the following
Main CBA(MCV-A)
------------
JACK CBA(MCV-C)
------------
SENSOR CBA
0VSA13549
Ref. No. Mark
Description
Part No.
Main CBA (MCV-A)
-----------
Consists of the following
CAPACITORS
C002
!
METALLIZED FILM CAP. 0.068
µ
F/275V K or
CT2E683HJE06
!
METALLIZED FILM CAP. 0.068
µ
F/250V K
CT2E683DC011
C003
!
SAFETY CAP. 2200pF/250V or
CCN2EMP0E222
!
SAFETY CAP. 2200pF/250V
CA2E222MR049
C004
ELECTROLYTIC CAP. 33
µ
F/400V M(L•Z)
CA2H330NC010
C005
CERAMIC CAP. B K 0.01
µ
F/500V
CCD2JKP0B103
C006
CERAMIC CAP. SL K 56pF/1KV or
CCD3AKPSL560
CERAMIC CAP. SL J 56pF/1KV
CCD3AJPSL560
C007
CERAMIC CAP.(AX) B K 1000pF/50V
CCA1JKT0B102
C008
CERAMIC CAP.(AX) X K 5600pF/16V
CCA1CKT0X562
C010
FILM CAP.(P) 0.022
µ
F/50V J or
CMA1JJS00223
FILM CAP.(P) 0.022
µ
F/50V J
CA1J223MS029
C011
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C012
ELECTROLYTIC CAP. 10
µ
F/50V M H7
CE1JMAVSL100
C014
ELECTROLYTIC CAP. 470
µ
F/35V M or
CE1GMASDL471
ELECTROLYTIC CAP. 470
µ
F/35V M
CE1GMASTL471
C017
ELECTROLYTIC CAP. 470
µ
F/16V M or
CE1CMASDL471
ELECTROLYTIC CAP. 470
µ
F/16V M
CE1CMASTL471
C018
ELECTROLYTIC CAP. 100
µ
F/16V M or
CE1CMASDL101
ELECTROLYTIC CAP. 100
µ
F/16V M
CE1CMASTL101
C020
ELECTROLYTIC CAP. 1000
µ
F/16V M
CE1CMZPTL102
C021
ELECTROLYTIC CAP. 470
µ
F/10V M or
CE1AMASDL471
ELECTROLYTIC CAP. 470
µ
F/10V M
CE1AMASTL471
C022
ELECTROLYTIC CAP. 22
µ
F/16V M H7
CE1CMAVSL220
C025
CERAMIC CAP.(AX) X K 5600pF/16V
CCA1CKT0X562
C026
ELECTROLYTIC CAP. 47
µ
F/16V M H7
CE1CMAVSL470
C053
ELECTRIC DOUBLE LAYER CAP0.047F/
5.5V Z or
CA0J473NE003
ELECTRIC DOUBLE LAYER CAP. 0.047F/
5.5V Z
CA0J473MS014
C056
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V
CHD1EK30B473
C057
CHIP CERAMIC CAP. CH J 470pF/50V or
CHD1JJ3CH471
CHIP CERAMIC CAP. CG J 470pF/50V
CHD1JJ3CG471
C151
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C152
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C153
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C154
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C155
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C156
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C157
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C158
CHIP CERAMIC CAP. B K 1000pF/50V
CHD1JK30B102
C159
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C251
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C252
CHIP CERAMIC CAP. B K 1000pF/50V
CHD1JK30B102
C253
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C254
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C302
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V
CHD1EK30B223
C303
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C304
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C305
CHIP CERAMIC CAP. F Z 0.22
µ
F/16V or
CHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22
µ
F/25V
CHD1EZ3FZ224
C307
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V
CHD1EK30B473
C308
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V
CHD1EK30B223
C309
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C310
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V
CHD1EK30B473
C312
CHIP CERAMIC CAP. B K 8200pF/50V
CHD1JK30B822
C313
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
Ref. No. Mark
Description
Part No.
Summary of Contents for 27C-250
Page 22: ...Main 2 7 Sensor Schematic Diagram 1 8 5 1 8 6 HE244SCM2...
Page 23: ...Main 3 7 Schematic Diagram 1 8 7 1 8 8 HE244SCM3...
Page 24: ...Main 4 7 Jack Schematic Diagram 1 8 9 1 8 10 HE244SCM4...
Page 26: ...Main 6 7 Schematic Diagram 1 8 13 1 8 14 HE244SCM6...
Page 30: ...1 8 21 1 8 22 Jack CBA Top View Jack CBA Bottom View BHE470F01012 C...
Page 54: ...3 1 1 HE240FEX A1X EXPLODED VIEWS Front Panel...
Page 71: ...27C 250 27C 254 HE244 249FD...