Fuji Electric MT5F33743 Manual Download Page 2

MT5F33743

1. Maximum Junction Temperature 

T

vjmax

© Fuji Electric Co., Ltd. All rights reserved.

As described in specification sheet, this automotive IGBT module can be used under 

T

vj 

=175

.

However, if junction temperature under operation is close to the maximum ratings, the products life 

time degradation might be happened by expediting thermal fatigue destruction.

Therefore, to keep safety operation, please use the product under suitable operating conditions.

This chapter describes precautions for actual operation of the IGBT module.

5-2

2. Short-Circuit Protection

When IGBT is to be short-circuit state, Collector current is increased and 

V

CE

voltage is rapidly

increased. From this characteristics, although Collector current is limited certain level under

short-circuit state, high power due to high voltage and high current is apply to the IGBT at this

moment. Therefore, this severe state should be removed as soon as possible.

An example by using gate driver IC which has short-circuit protection function is shown in chapter 7,

please refer it.

As it is explained in chapter 1, this IGBT module has on-chip current detecting sensor. Its function

and characteristics are shown in chapter 8.

So please use this on-chip sensor for short-circuit protection function suitably.

On the other, because this IGBT module does not have corrector voltage detecting point on each

arm, desaturation type of short-circuit protection method shall not be used to avoid any unexpected

trouble.

3. Overvoltage Protection and Safety Operation Area

3.1 Overvoltage protection

Because switching speed of IGBT is very fast, large d

i

/d

t

is produced in turn-off operation or reverse

recovery. So from this large d

i

/d

t

and inductance component contained inside and outside this module 

surge voltage is produced. If this surge voltage is excessed the device breakdown voltage, the device 

is in overvoltage state and it would be destructed in the worst case. Followings are some examples to 

avoid this kind of worst case:

1) Add snubber circuit  2) Tune the gate resistance    3) Reduce inductance in the main circuit

Images of turn-off waveform and reverse recovery waveform are shown in Fig. 5-1 and surge voltage

is defined.

(a) Turn-off

(b) Reverse recovery

Fig. 5-1 Turn-off waveform, reverse recovery waveform and surge voltage

V

AK

I

C

V

AKP

0

0

V

CE

I

C

V

CEP

0

0

Summary of Contents for MT5F33743

Page 1: ...imum Junction Temperature Tvjmax 5 2 2 Short Circuit Protection 5 2 3 Over Voltage Protection and Safety Operation Area 5 2 4 Operation Condition and Dead Time Setting 5 7 5 Parallel Connections 5 8 6 Electrostatic Discharge Countermeasures and Gate Protection 5 9 7 ESD Conductive Foam 5 10 ...

Page 2: ...ned in chapter 1 this IGBT module has on chip current detecting sensor Its function and characteristics are shown in chapter 8 So please use this on chip sensor for short circuit protection function suitably On the other because this IGBT module does not have corrector voltage detecting point on each arm desaturation type of short circuit protection method shall not be used to avoid any unexpected...

Page 3: ...s to be within RBSOA on actual system like invertor If surge voltage is excess guaranteed RBSOA surge voltage shall be suppressed by adding snubber circuit by reducing stray inductance by tuning gate resistance and so on In addition when surge voltage is reduced by gate resistance it is able to be effective operating condition to independently tune the gate resistance of turn on and turn off respe...

Page 4: ... of SOA of FWD part 3 3 Safety operation area SOA of FWD part As same as RBSOA of IGBT SOA of FWD part is also defined SOA of diode is defined as acceptable area of maximum power Pmax which is the product of current and voltage during reverse recovery operation Therefore any system shall be designed that locus of current and voltage during reverse recovery should be within SOA An example of SOA of...

Page 5: ...tions which happen dynamic avalanche shall not be applied because there is possibility of IGBT destruction by turn off loss increase and latch up phenomenon There are many causes of dynamic avalanche like long wiring of main circuit To prevent this dynamic avalanche IGBT module shall be used within RBSOA condition at least 5 5 Fig 5 6 An example of dynamic avalanche waveform 150 VCC 500V IC 2000A ...

Page 6: ...le of active clamp circuits In the circuits Zenner diode and a diode connected with the anti series in the Zenner diode are added When the VCE over breakdown voltage of Zenner diode is applied IGBT will be turned off with the similar voltage as breakdown voltage of Zenner diode FWD Zenner Di Di IGBT Therefore installing the active clamp circuits can suppress the spike voltage Moreover avalanche cu...

Page 7: ...ns under the maximum rated G E voltage VGES 20V 2 It is recommended that supply voltage fluctuations are kept to within 10 3 IGBT turn off characteristics are heavily dependent on VGE especially when the collector current is just beginning to switch off Consequently the greater the VGE the shorter the switching time and the switching loss become smaller 4 If the VGE is too small dv dt shoot throug...

Page 8: ...cessary to consider other drive conditions and the temperature characteristics It is important to be careful with dead times that are too short because in the event of a short circuit in the upper or lower arms the heat generated by the short circuit current may destroy the module Therefore appropriate dead time should be settled by the confirmation of practical machine Fig 5 10 Dead time timing c...

Page 9: ...le the module using the package body 3 When performing soldering work on the IGBT terminal make sure to ground the tip of the soldering iron with an adequately low resistance to ensure that static electricity is not applied to the IGBT through soldering iron or solder bath leakage Furthermore the IGBT is susceptible to breakdown if voltage is applied between the collector and emitter while the gat...

Page 10: ... product in a piece of equipment it is requested that you only remove the conductive foam just before PCB mounting in order to prevent electrostatic discharge damage Refer to the following workflow 7 ESD Conductive Foam 5 10 4 PCB mounting and control terminal soldering 3 Conductive foam removal Fig 5 12 Conductive foam removal procedures 1 Unpacking 2 Moving process Do not remove the conductive f...

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