Tower KW2xDxxx Hardware Reference Manual, Rev. 0.2
Freescale Semiconductor
4-1
Chapter 4
PCB Manufacturing Specifications
This chapter provides the specifications used to manufacture the TWR-KW2xDxxx Development
hardware printed circuit board (PCB) described in this manual.
The TWR-KW2xDxxx Development hardware PCBs must comply with the following:
•
The PCB must comply with Perfag10/3C (
http://www.perfag.dk/Uk/ukindex.htm
)
•
The PCB manufacturer’s logo is required
•
The PCB production week and year code is required
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
mask
— The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
•
The required Underwriter’s Laboratory (UL) Flammability Rating
— The level is 94V-0 (
http://www.ul.com/plastics/flame.html
)
— The UL information must be stamped on the back of the PCB solder mask
NOTE
•
A complete set of design files is available for the TWR-KW2xDxxx
Development hardware at the Freescale web site
(
http:www.freescale.com/zigbee
) under reference designs. It is
recommended that this design or one of a number of other reference
designs be used as a starting point for a custom application.
•
The
Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual
, (ZHDCRM) is also available at the
same web site to provide additional design guidance.
4.1
Single PCB Construction
This section describes individual PCB construction details.
•
The TWR-KW2xDxxx PCB is a four-layer, multi layer designs
•
The PCBs contains no blind, buried, or micro vias
•
PCB data:
— TWR-KW2xDxxx Size: Approximately 90 x 83mm (3.55 x 3.28inches)
— TWR-KW2xDxxx Final thickness (Cu/Cu): 1.57 mm (0.62 inches) +/- 10% (excluding solder
mask)
