USER MANUAL
Micro Reach Xtend
TM
(NN01-110)
Last updated on May 2020
© 2020 FRACTUS ANTENNAS, S.L. -
11
As a surface mount device (SMD), this antenna is compatible with industry standard soldering
processes. The basic assembly procedure for this antenna is as follows:
1.
Apply a solder paste to the pads of the PCB. Place the antenna on the board.
2.
Perform a reflow process according to the temperature profile detailed in Table 3, Figure 8 on
page 12.
3.
After soldering the antenna to the circuit board, perform a cleaning process to remove any
residual flux. Fractus Antennas recommends conducting a visual inspection after the cleaning
process to verify that all reflux has been removed.
The drawing below shows the soldering details obtained after a correct assembly process:
Figure 7
–
Soldering Details.
NOTE(*)
: Solder paste thickness after the assembly process will depend on the thickness of the
soldering stencil mask. A stencil thickness equal to or larger than
127 microns (5 mils)
is
required.
The Micro Reach Xtend
TM
antenna should be assembled following either Sn-Pb or Pb-free
assembly processes. According to the Standard
IPC/JEDEC J-STD-020C
, the temperature
profile suggested is as follows:
Phase
Profile features
Pb-Free Assembly (SnAgCu)
RAMP-UP
Avg. Ramp-up Rate (Tsmax to Tp)
3 ºC / second (max.)
PREHEAT
-
Temperature Min (Tsmin)
-
Temperature Max (Tsmax)
-
Time (tsmin to tsmax)
150 ºC
200 ºC
60-180 seconds
REFLOW
-
Temperature (TL)
-
Total Time above TL (tL)
217 ºC
60-150 seconds
PEAK
-
Temperature (Tp)
-
Time (tp)
260 ºC
20-40 seconds
RAMP-DOWN
Rate
6 ºC/second max
Time from 25 ºC to Peak Temperature
8 minutes max
Table 3
–
Recommended soldering temperatures.
