USER MANUAL
ALL mXTEND
TM
(FR01-S4-220)
Last updated on June 2017
© 2017 FRACTUS ANTENNAS, S.L. -
13
5.
ASSEMBLY PROCESS
Figure 6 shows the back and front views of the ALL mXTEND
TM
chip antenna component FR01-
S4-220. Due to the product configuration, the feeding pad can only be the pad 1.
Figure 6
–
Pads of the ALL mXTEND
TM
chip antenna component FR01-S4-220.
As a surface mount device (SMD), the ALL mXTEND
TM
chip antenna component is compatible
with industry standard soldering processes. The basic assembly procedure for the ALL
mXTEND
TM
chip antenna component is as follows:
1.
Apply a solder paste on the pads of the PCB. Place the ALL mXTEND
TM
chip antenna
component on the board.
2.
Perform a reflow process according to the temperature profile detailed in Table 4, Figure 8.
3.
After soldering the ALL mXTEND
TM
chip antenna component to the circuit board, perform a
cleaning process to remove any residual flux. Fractus Antennas recommends conducting a
visual inspection after the cleaning process to verify that all reflux has been removed.
The drawing below shows the soldering details obtained after a correct assembly process:
Figure 7
–
Soldering Details.
NOTE(*):
Solder paste thickness after the assembly process will depend on the thickness of the
soldering stencil mask. A stencil thickness equal or larger than
127 microns (5 mils)
is
required.
ALL mXTEND
TM
chip antenna component
PCB
Solder Paste
ALL mXTEND
TM
chip antenna component
PCB
~ 0.1* mm
Mounting Pads (2, 3, 4)
:
solder the ALL mXTEND
TM
chip antenna component
mounting pads to the soldering pad on the PCB. These pads must NOT be grounded.
Feed Pad (1)
: The location of the 4 pads is fully symmetrical. Align the feed pad with the feeding line on
the PCB. See section 4.3.
1
2
3
4
