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L850-GL Hardware User Manual Page 4 of 54

Contents

Foreword ............................................................................................................................................ 7

1.1

Introduction .......................................................................................................................... 7

1.2

Reference Standard ............................................................................................................. 7

1.3

Related Documents ............................................................................................................. 7

Overview ............................................................................................................................................ 8

2.1

Introduction .......................................................................................................................... 8

2.2

Specification ......................................................................................................................... 8

2.3

Warning ................................................................................................................................ 9

2.3.1

FCC Statement ............................................................................................................. 9

2.3.2

IC Statement ................................................................................................................ 11

2.3.3

CE Statement .............................................................................................................. 12

2.4

CA combinations ................................................................................................................ 13

2.5

Application Framework ...................................................................................................... 14

2.6

Hardware Block Diagram ................................................................................................... 14

Application Interface ......................................................................................................................... 16

3.1

M.2 Interface ...................................................................................................................... 16

3.1.1

Pin Map ...................................................................................................................... 16

3.1.2

Pin Definition ............................................................................................................... 17

3.2

Power Supply ..................................................................................................................... 21

3.2.1

Power Supply .............................................................................................................. 21

3.2.2

Logic level ................................................................................................................... 22

3.2.3

Power Consumption ................................................................................................... 23

3.3

Control Signal .................................................................................................................... 25

3.3.1

Module Start-Up .......................................................................................................... 26

3.3.1.1

Start-up Circuit ..................................................................................................... 26

3.3.1.2

Start-up Timing Sequence ................................................................................... 26

3.3.2

Module Shutdown ....................................................................................................... 27

3.3.3

Module Reset .............................................................................................................. 28

3.3.4

PCIe Reset ................................................................................................................. 29

3.4

PCIe & USB ....................................................................................................................... 30

3.4.1

PCIe Interface ............................................................................................................. 30

3.4.1.1

PCIe Interface Definition ...................................................................................... 30

3.4.1.2

PCIe Interface Application ................................................................................... 31

Summary of Contents for L850-GL

Page 1: ...L850 GL Hardware User Manual Version 1 0 6 Update date Feb 26th 2018 ...

Page 2: ...ute any explicit or implicit guarantee Trademark The trademark is registered and owned by Fibocom Wireless Inc Version Record Version Update date Remark V1 0 0 2016 12 08 Draft V1 0 1 2016 12 16 Modify the PCIe Interface Application Update the Pin Definition change pin65 to NC V1 0 2 2017 02 09 Modify the description Update the content of PCIe Add the power Consumption of 3CA V1 0 3 2017 07 26 1 U...

Page 3: ...Fibocom Wireless Inc written authorization All Rights Reserved L850 GL Hardware User Manual Page 3 of 54 Applicability Table No Product model Description 1 L850 GL 00 NA 2 L850 GL 01 NA 3 L850 GL 03 NA 4 L850 GL 05 NA 5 L850 GL 10 NA ...

Page 4: ...12 2 4 CA combinations 13 2 5 Application Framework 14 2 6 Hardware Block Diagram 14 3 Application Interface 16 3 1 M 2 Interface 16 3 1 1 Pin Map 16 3 1 2 Pin Definition 17 3 2 Power Supply 21 3 2 1 Power Supply 21 3 2 2 Logic level 22 3 2 3 Power Consumption 23 3 3 Control Signal 25 3 3 1 Module Start Up 26 3 3 1 1 Start up Circuit 26 3 3 1 2 Start up Timing Sequence 26 3 3 2 Module Shutdown 27 ...

Page 5: ...ot Plugging 37 3 5 4 USIM Design 37 3 6 Status Indicator 38 3 6 1 LED 1 Signal 38 3 7 Interrupt Control 39 3 7 1 W_DISABLE1 39 3 7 2 BODYSAR 39 3 8 Clock Interface 40 3 9 ANT Tunable Interface 40 3 10 Configuration Interface 40 3 11 Other Interfaces 41 4 Radio Frequency 42 4 1 RF Interface 42 4 1 1 RF Interface Functionality 42 4 1 2 RF Connector Characteristic 42 4 1 3 RF Connector Dimension 42 4...

Page 6: ...ithout Fibocom Wireless Inc written authorization All Rights Reserved L850 GL Hardware User Manual Page 6 of 54 5 4 M 2 Connector 51 5 5 Storage 52 5 5 1 Storage Life 52 5 6 Packing 52 5 6 1 Tray Package 52 5 6 2 Tray size 53 ...

Page 7: ... 3GPP TS 36 521 1 V11 4 0 User Equipment UE conformance specification Radio transmission and reception Part 1 Conformance testing 3GPP TS 21 111 V10 0 0 USIM and IC card requirements 3GPP TS 51 011 V4 15 0 Specification of the Subscriber Identity Module Mobile Equipment SIM ME interface 3GPP TS 31 102 V10 11 0 Characteristics of the Universal Subscriber Identity Module USIM application 3GPP TS 31 ...

Page 8: ...6 LTE TDD Band 38 39 40 41 WCDMA HSPA Band 1 2 4 5 8 GNSS Beidou support Data Transmission LTE FDD 450Mbps DL 50Mbps UL Cat 9 LTE TDD 347Mbps DL 30Mbps UL Cat 9 When LTE TDD achieves maximum DL rate its UL rate can reach 10Mbps only UMTS HSPA UMTS 384 kbps DL 384 kbps UL DC HSPA 42Mbps DL Cat 24 5 76Mbps UL Cat6 Power Supply DC 3 135V 4 4V Typical 3 3V Temperature Normal operating temperature 10 C...

Page 9: ... update AGNSS Note When temperature goes beyond normal operating temperature range of 10 C 55 C RF performance of module may be slightly off 3GPP specifications For normal operating temperature LTE FDD Band 4 and 13 can support temperature ranging from 20 to 60 2 3 Warning 2 3 1 FCC Statement Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules...

Page 10: ...ent into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help FCC Caution Any changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate this equipment This transmitter must not be co located or operating in conjunction with any other an...

Page 11: ...ual of the end product which integrates this module The end user manual shall include all required regulatory information warning as show in this manual 2 3 2 IC Statement Industry Canada statement This device complies with Industry Canada license exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any in...

Page 12: ...tion d exposition aux radiations Cet équipement est conforme aux limites d exposition aux rayonnements IC établies pour un environnement non contrôlé Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps IC 21374 L850GLD 2 3 3 CE Statement EU Regulatory Conformance Hereby We Fibocom Wireless Inc declares that the radio equip...

Page 13: ... 11 12 30 13 66 29 30 Intra band non contiguous 2 3 4 7 41 Intra band contiguous 2 3 7 40 41 3CA Inter band 1 3 7 1 3 8 1 3 19 1 3 20 1 3 28 1 7 20 1 7 28 1 8 11 1 19 21 2 4 5 2 4 13 2 5 30 2 12 30 2 29 30 2 5 66 2 13 66 3 7 20 3 7 28 4 5 30 4 12 30 4 29 30 2 intra band non contiguous plus inter band 2 2 5 2 2 13 4 4 5 4 4 13 2 intra band contiguous plus inter band 2 2 29 3 3 1 3 3 5 3 3 7 3 3 20 ...

Page 14: ...ontrol EINT Indicator Host application Main ANT Div ANT SIM Card PCIe USB3 0 Figure2 1 Application Framework 2 6 Hardware Block Diagram The hardware block diagram in Figure 2 2 shows the main hardware functions of L850 module including base band and RF functions Baseband contains the followings GSM UMTS LTE FDD controller Power supply NAND internal LPDDR2 RAM Application interface RF contains the ...

Page 16: ...ss Inc written authorization All Rights Reserved L850 GL Hardware User Manual Page 16 of 54 3 Application Interface 3 1 M 2 Interface The L850 module applies standard M 2 Key B interface with a total of 75 pins 3 1 1Pin Map Figure 3 1 Pin Map Note ...

Page 17: ...pply 4 3 3V PI Power input Power Supply 5 GND GND Power Supply 6 FULL_CARD_ POWER_OFF I PU Power enable Module power on input internal pull up CMOS 3 3 1 8V 7 USB D I O USB Data Plus 0 3 3V 8 W_DISABLE1 I PD WWAN Disable active low CMOS 3 3 1 8V 9 USB D I O USB Data Minus 0 3 3V 10 LED1 O T System status LED Output open drain CMOS 3 3V CMOS 3 3V 11 GND GND Power Supply 12 Notch Notch 13 Notch Notc...

Page 18: ...ignment select Reserved CMOS 1 8V 29 USB3 0_TX O USB3 0 Transmit data minus 30 UIM_RESET O L SIM reset signal 1 8V 3V 31 USB3 0_TX O USB3 0 Transmit data plus 32 UIM_CLK O L SIM clock Signal 1 8V 3V 33 GND GND 电源 34 UIM_DATA I O L SIM data input output 1 8V 3V 35 USB3 0_RX I USB3 0 receive data minus 36 UIM_PWR O SIM power supply 3V 1 8V 1 8V 3V 37 USB3 0_RX I USB3 0 receive data plus 38 NC NC 39 ...

Page 19: ...ilable active clock state in order to transmit data It also used by L1 PM Sub states mechanism asserted by either host or device to initiate an L1 exit Active low internal pull up 10KΩ CMOS 3 3V 53 REFCLKN I PCIe Reference Clock signal Negative 54 PEWAKE O L Asserted to wake up system and reactivate PCIe link from L2 to L0 it depends on system whether supports wake up functionality Active low open...

Page 20: ...T modules based on BT SIG coexistence protocol UART transmit signal WWAN module side Reserved CMOS 1 8V 65 NC NC 66 SIM_DETECT I PD SIM Detect internal pull up 390KΩ active high CMOS 1 8V 67 RESET I WWAN reset input internal pull up 10KΩ active low CMOS 1 8V 68 NC NC 69 CONFIG_1 O GND GND L850 M 2 module is configured as the WWAN PCIe USB3 0 interface type 70 3 3V PI Power input Power Supply 71 GN...

Page 21: ...ue 2 4 70 72 74 3 3V PI Power supply input 3 135 3 3 4 4 36 UIM_PWR PO USIM power supply 1 8V 3V L850 module uses PCIe interface according to the PCIe specification the PCIe Vmain should be used as the 3 3V power source not the Vaux The Vaux is the PCIe backup power source and it is not sufficient as the power supply In addition the DC DC power supply other than PCIe ports should not be used as th...

Page 22: ...rference generated from the clock and digital signals 39pF 33pF 700 800 850 900 MHz frequency band Filter out low frequency band RF interference 18pF 8 2pF 6 8pF 1500 1700 1800 1900 2100 2300 2500 2600MHzfrequency band Filter out medium high frequency band RF interference The stable power supply can ensure the normal operation of L850 module and the ripple of the power supply should be less than 3...

Page 23: ...of 3 3V power supply the L850 power consumption as shown in the following table Parameter Mode Condition Average Current mA Ioff Power off Power supply module power off 0 08 ISleep WCDMA DRX 6 3 3 DRX 8 2 6 DRX 9 2 4 LTE FDD Paging cycle 64 frames 0 64 sec DRx cycle 3 8 LTE TDD Paging cycle 64 frames 0 64 sec DRx cycle 4 2 Radio Off AT CFUN 4 Flight mode 2 0 IWCDMA RMS WCDMA WCDMA Data call Band 1...

Page 24: ...Bm 620 LTE FDD Data call Band 19 23dBm 580 LTE FDD Data call Band 20 23dBm 650 LTE FDD Data call Band 21 23dBm 850 LTE FDD Data call Band 26 23dBm 580 LTE FDD Data call Band 28 23dBm 600 LTE FDD Data call Band 30 22dBm 820 LTE FDD Data call Band 66 23dBm 780 LTE TDD LTE TDD Data call Band 38 23dBm 450 LTE TDD Data call Band 39 23dBm 350 LTE TDD Data call Band 40 23dBm 380 LTE TDD Data call Band 41...

Page 25: ...00 Band 19 22dBm 690 Band 20 22dBm 730 Band 21 22dBm 890 Band 28 22dBm 670 Band 30 21dBm 910 Band 66 22dBm 820 Note The data above is an average value obtained by testing some samples 3 3 Control Signal The L850 module provides two control signals for power on off and reset operations the pin defined as shown in the following table Pin Pin Name I O Reset Value Functions Type 6 FULL_CARD_POWER _OFF...

Page 26: ...l up for booting up The VDD_1V8 should be provided from the external circuit AP Application Processor controls the module start up and the circuit design is shown in Figure3 4 Figure 3 4 Circuit for Module Start up Controlled by AP 3 3 1 2 Start up Timing Sequence When power supply is ready the PMU of module will power on and start initialization process by pulling high FULL_CARD_POWER_OFF signal ...

Page 27: ... down by sending AT CFUN 0 command When the module receives the software shutdown command the module will start the finalization process the reverse process of initialization and it will be completed after tsd time tsd is the time which AP receive OK of AT CFUN 0 if there is no response the max tsd is 5s In the finalization process the module will save the network SIM card and some other parameter...

Page 28: ...on the PMU remains its power inside the module The recommended circuit design is shown in the Figure 3 7 Figure 3 7 Recommended Design for Reset Circuit There are two reset control timings as below Host may keep FULL_CARD_POWER_OFF high when system restarting module reset timing is shown in the Figure 3 8 Host may assert FULL_CARD_POWER_OFF high when system restarting module reset timing is shown ...

Page 29: ...ET PERST is not required for modem restart thus this pin can be remains high during restart Note RESET is a sensitive signal it s recommended to add a filter capacitor close to the module In case of PCB layout the RESET signal lines should keep away from the RF interference and protected by GND Also the RESET signal lines shall neither near the PCB edge nor route on the surface planes to avoid mod...

Page 30: ...nd one data transmission channel After L850 module is inserted into PC PCIe interface can work with the drive program map an MBIM port and a GNSS port in Win10 system While MBIM interface is used for initiating data service in Win10 system and GNSS interface for receiving GNSS data 3 4 1 1 PCIe Interface Definition Pin Pin Name I O Reset Value Description Type 41 PETn0 O PCIe TX Differential signa...

Page 31: ...ive low open drain output and should add external pull up on platform CMOS 3 3V 3 4 1 2 PCIe Interface Application The reference circuit is shown in Figure 3 11 Figure 3 11 Reference Circuit for PCIe Interface L850 module supports one PCIe 1 0 interface including three difference pairs transmit pair TXP N receiving pair RXP N and clock pair CLKP N PCIe can achieve the maximum transmission rate of ...

Page 32: ... be greater than 1 5 times line width at least When a serpentine line is used for length match with another line the bended length of each segment shall be at least 3 times the line width 3W The largest spacing between the bended part of the serpentine line and another one of the differential lines must be less than 2 times the spacing of normal differential lines S1 2S Figure 3 12 Requirement of ...

Page 33: ...of L850 module please refer to Universal Serial Bus Specification 2 0 and Universal Serial Bus Specification 3 0 When module inserted PC USB can enumerate three ACM and three NCM ports in Android Linux system the ports can be configured in practical application 3 4 2 1 USB Interface Definition Pin Pin Name I O Description Type 7 USB_D I O USB Data Plus 0 3 3V USB2 0 9 USB_D I O USB Data Minus 0 3 ...

Page 34: ...tial impedance of 90 ohms USB_D and USB_D signal lines should be parallel and have the equal length the right angle routing should be avoided USB_D and USB_D signal lines should be routed on the layer that is adjacent to the ground layer and wrapped with GND vertically and horizontally 3 4 2 3 USB3 0 Interface Application The reference circuit is shown in Figure 3 15 Figure 3 15 Reference Circuit ...

Page 35: ...and 3V SIM cards 3 5 1 USIM Pins The USIM pins description as shown in the following table Pin Pin Name I O Reset Value Description Type 36 UIM_PWR PO USIM power supply 1 8V 3V 30 UIM_RESET O L USIM reset 1 8V 3V 32 UIM_CLK O L USIM clock 1 8V 3V 34 UIM_DATA I O L USIM data internal pull up 4 7KΩ 1 8V 3V 66 SIM_DETECT I PD USIM card detect internal 390K pull up Active high and high level indicates...

Page 36: ... the SIM card is inserted it connects an open circuit between CD and SW pins and drives the SIM_DETECT pin high 3 5 2 2 N O SIM Card Slot The reference circuit design for N O Normally Open SIM card slot is shown in Figure 3 17 Figure 3 17 Reference Circuit for N O SIM Card Slot The principles of the N O SIM card slot are described as follows When the SIM card is detached it connects an open circui...

Page 37: ... that the SIM card is inserted when the SIM_DETECT pin is high then executes the initialization program and finish the network registration after reading the SIM card information When the SIM_DETECT pin is low the module determines that the SIM card is detached and does not read the SIM card Note By default SIM_DETECT is active high which can be switched to active low by the AT command Please refe...

Page 38: ... indicator pins as shown in the following table Pin Pin Name I O Reset Value Pin Description Type 10 LED1 O PD System status LED drain output CMOS 3 3V 23 WOWWAN O PU Module wakes up Host AP Reserved CMOS 1 8V 48 TX_BLANKING O PD PA Blanking output external GPS control signal Reserved CMOS 1 8V 3 6 1 LED 1 Signal The LED 1 signal is used to indicate the operating status of the module and the detai...

Page 39: ...finition of W_DISABLE1 signal is as follows W_DISABLE1 signal Function High Floating WWAN function is enabled the module exits the Flight mode Low WWAN function is disabled the module enters Flight mode Note The function of W_DISABLE1 can be customized please refer to the software porting guide 3 7 2 BODYSAR The L850 module supports Body SAR function by detecting the DPR pin The voltage level of D...

Page 40: ...flexibly configure the bands of LTE antenna to improve the antenna s working efficiency and save space for the antenna Pin Pin Name I O Pin Description Type 56 RFE_RFFE2_ SCLK O Tunable ANT control MIPI Interface RFFE2 clock Open Drain output CMOS 3 3 1 8V 58 RFE_RFFE2_ SDATA O Tunable ANT control MIPI Interface RFFE2 data Open Drain output CMOS 3 3 1 8V 59 ANTCTL0 O Tunable ANT control GPO interf...

Page 41: ...ally connected to GND 75 CONFIG_2 O L Internally connected to GND The M 2 module configuration as the following table Config_0 pin21 Config_1 pin69 Config_2 pin75 Config_3 pin1 Module Type and Main Host Interface Port Configuration GND GND GND NC WWAN USB3 1 PCIe Gen1 0 Please refer to PCI Express M 2 Specification Rev1 1 for more details 3 11 Other Interfaces The module does not support other int...

Page 42: ...in antenna used to receive and transmit RF signals D G is for Diversity antenna used to receive the diversity RF signals Figure 4 1 RF connectors 4 1 2RF Connector Characteristic Rated Condition Environment Condition Frequency Range DC to 6GHz Temperature Range Characteristic Impedance 50Ω 40 C to 85 C 4 1 3RF Connector Dimension The L850 module adopts standard M 2 module RF connectors the model n...

Page 43: ...c written authorization All Rights Reserved L850 GL Hardware User Manual Page 43 of 54 Figure 4 2 RF connector dimensions Figure 4 3 0 81mm coaxial antenna dimensions Figure 4 4 Schematic diagram of 0 81mm coaxial antenna connected to the RF connector ...

Page 44: ...0MHz LTE FDD WCDMA 880 915 925 960 Band 11 1500MHz LTE FDD 1427 9 1447 9 1475 9 1495 9 Band 12 700MHz LTE FDD 699 716 729 746 Band 13 700MHz LTE FDD 777 787 746 756 Band 17 700MHz LTE FDD 704 716 734 746 Band 18 800MHz LTE FDD 815 830 860 875 Band 19 800MHz LTE FDD 830 845 875 890 Band 20 800MHz LTE FDD 832 862 791 821 Band 21 1500MHz LTE FDD 1447 9 1462 9 1495 9 1510 9 Band 26 850MHz LTE FDD 814 ...

Page 45: ...23 1 10MHz Bandwidth 1 RB Band 2 23 2 7 23 1 10MHz Bandwidth 1 RB Band 3 23 2 7 23 1 10MHz Bandwidth 1 RB Band 4 23 2 7 23 1 10MHz Bandwidth 1 RB Band 5 23 2 7 23 1 10MHz Bandwidth 1 RB Band 7 23 2 7 23 1 10MHz Bandwidth 1 RB Band 8 23 2 7 23 1 10MHz Bandwidth 1 RB Band 11 23 2 7 23 1 10MHz Bandwidth 1 RB Band 12 23 2 7 23 1 10MHz Bandwidth 1 RB Band 13 23 2 7 23 1 10MHz Bandwidth 1 RB Band 17 23 ...

Page 46: ...0 module as shown in the following table Mode Band 3GPP Requirement dBm Rx Sensitivity dBm Typical Note WCDMA Band 1 106 7 110 BER 0 1 Band 2 104 7 110 BER 0 1 Band 4 106 7 110 BER 0 1 Band 5 104 7 111 BER 0 1 Band 8 103 7 110 BER 0 1 LTE FDD Band 1 96 3 101 5 10MHz Bandwidth Band 2 94 3 101 5 10MHz Bandwidth Band 3 93 3 102 10MHz Bandwidth Band 4 96 3 102 10MHz Bandwidth Band 5 94 3 103 10MHz Ban...

Page 47: ...6 3 101 5 10MHz Bandwidth Band 40 96 3 100 5 10MHz Bandwidth Band 41 94 3 100 10MHz Bandwidth Note The above values are measured for the dual antennas situation Main Diversity For single main antenna without Diversity the sensitivity will drop around 3dBm for each band of LTE 4 5 GNSS L850 module supports GNSS BeiDou and AGNSS functions and adopts RF Diversity and GNSS Beidou integrated antenna De...

Page 48: ... Acquisition 149dBm GLONASS Tracking 160dBm Acquisition 146dBm BeiDou Tracking 160dBm Acquisition 141dBm Note Please note that GPS current is tested with RF disabled 4 6 Antenna Design The L850module provides main and diversity antenna interfaces and the antenna design requirements as shown in the following table L850 module Main antenna requirements Frequency range The most proper antenna to adap...

Page 49: ...Hz LTE Band 12 700 47 MHz LTE Band 13 700 41 MHz LTE Band 17 700 42 MHz LTE Band 18 800 80 MHz LTE Band 19 800 80 MHz LTE band 20 800 71 MHz LTE band 21 1500 63 MHz LTE band 26 850 80 MHz LTE band 28 700 100 MHz LTE band 29 700 12 MHz LTE band 30 2300 55 MHz LTE band 66 1700 490 MHz LTE band 38 2600 50 MHz LTE Band 39 1900 40 MHz LTE band 40 2300 100 MHz LTE band 41 2500 194 MHz Bandwidth GNSS Bei...

Page 50: ... Hardware User Manual Page 50 of 54 5 Structure Specification 5 1 Product Appearance The product appearance for L850 module is shown in Figure5 1 Figure 5 1 Module Appearance 5 2 Dimension of Structure The structural dimension of the L850 module is shown in Figure 5 2 Figure 5 2 Dimension of Structure ...

Page 51: ...in Figure 3 1 For module dimension please refer to 5 2 Dimension of Structure Based on the M 2 interface definition L850 module adopts Type 3042 S3 B interface 30x42mm the component maximum height on t top layer is 1 5mm PCB thickness is 0 8mm and KEY ID is B 5 4 M 2 Connector The L850 module connects to AP via M 2 connector it is recommended to use M 2 connector from LOTES company with the model ...

Page 52: ...storage conditions the storage life is 12 months 5 6 Packing The L850 module uses the tray sealed packing combined with the outer packing method using the hard cartoon box so that the storage transportation and the usage of modules can be protected to the greatest extent Note The module is a precision electronic product and may suffer permanent damage if no correct electrostatic protection measure...

Page 53: ...c written authorization All Rights Reserved L850 GL Hardware User Manual Page 53 of 54 in each case Tray packaging process is shown in Figure 5 4 Figure 5 4 Tray Packaging Process 5 6 2 Tray size The pallet size is 330 175 6 0mm as shown in Figure 5 5 ...

Page 54: ...tion All Rights Reserved L850 GL Hardware User Manual Page 54 of 54 Figure 5 5Tray Size Unit mm ITEM DIM Unit mm L 330 0 0 5 W 175 0 0 5 H 6 0 0 3 T 0 5 0 1 A0 43 0 3 B0 33 0 0 3 A1 294 0 0 3 B1 159 0 0 3 C 20 0 0 5 D 9 0 0 5 E 24 5 0 5 F 187 5 0 2 G 105 0 0 2 J 9 0 0 2 ...

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