X
X
R
R
P
P
6
6
1
1
4
4
2
2
S
S
y
y
n
n
c
c
h
h
r
r
o
o
n
n
o
o
u
u
s
s
S
S
t
t
e
e
p
p
-
-
D
D
o
o
w
w
n
n
C
C
o
o
n
n
t
t
r
r
o
o
l
l
l
l
e
e
r
r
w
w
i
i
t
t
h
h
D
D
D
D
R
R
M
M
e
e
m
m
o
o
r
r
y
y
T
T
e
e
r
r
m
m
i
i
n
n
a
a
t
t
i
i
o
o
n
n
© 2010 Exar Corporation
2/6
Rev. 0.0.2
PIN ASSIGNEMENT
Figure 2: XRP6142 Pin Assignment
PIN DESCRIPTION
Name
Pin Number
Description
AGND 1
Analog
Ground
VTTREF 2
V
TT
reference for DDR applications. Buffered output of VDDQ/2
VDDQ/2
3
Voltage used for the input to the V
TT
buffer
V
REF
4
Precision reference output
REFIN
5
Reference input to the switching-regulator feedback comparator
FB
6
Feedback input to feedback comparator
CSGND 7
Current-sense
ground
ILIM 8
Connect a resistor between this pin and the low-side current-sense element in order to
set the current-limit-trip threshold. See applications section for instructions on how to
set this resistor
PGND
9
Gate driver GND.
GL
10
Low-side N-channel MOSFET driver
SW
11
Switch node for floating-high-side gate drive
GH
12
High-side N-channel MOSFET driver
BST
13
Bootstrap capacitor to drive the high-side gate driver, GH
V
IN
14
Input voltage for the power train
Vcc 15
Input voltage for the XRP6142 internal circuitry and gate drives. Vin and Vcc can be
tied together when Vin
≥
3.0V
EN
16
Precision enable pin. Pulling this pin above 1.2V will turn the part on
Thermal pad
-
Internally connected to AGND
ORDERING INFORMATION
Refer to XRP6142’s datasheet and/or
www.exar.com
for exact and up to date ordering information.
