Espressif ESP32--S3 Series, Hardware Design Manuallines

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CONFIDENTIAL
3 PCB Layout Design
Note:
If you need to add a thermal pad EPAD under the chip on the bottom of the module, it is recommended to employ a
nine-grid on the EPAD, cover the gaps with ink, and place ground vias in the gaps, as shown in Figure 16 . This can avoid
tin leakage when soldering the module EPAD to the substrate.
Figure 16: ESP32­S3 Analog Power Traces in a Four­layer PCB Design
3.4 Crystal Oscillator
Figure 17 shows the reference design of the crystal oscillator. In addition, the following should be noted:
• The crystal oscillator should be placed far from the clock pin to avoid the interference on the chip.
The gap
should be at least 2.0 mm
. It is good practice to add high-density ground via stitching around the clock
trace for better isolation.
• There should be no vias for the clock input and output traces, which means the traces cannot cross layers.
• The external regulating capacitor should be placed on the near left or right side of the crystal oscillator, and
at the end of the clock trace whenever possible, to make sure the ground pad of the capacitor is close to
that of the crystal oscillator.
• Do not route high-frequency digital signal traces under the crystal oscillator. It is best not to route any signal
trace under the crystal oscillator. The vias on the power traces on both sides of the crystal clock trace
should be placed as far away from the clock trace as possible, and the two sides of the clock trace should
be surrounded by grounding copper.
• As the crystal oscillator is a sensitive component, do not place any magnetic components nearby that may
cause interference, for example large inductance component, and ensure that there is a clean large-area
ground plane around the crystal oscillator.
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ESP32-S3 Series Hardware Design Guidelines v1.0