PRE
LI
MI
NA
RY
5. Electrical Characteristics
5.6 Reflow Profile
Tem
per
at
ur
e
(
)
Peak Temp.
250
235 ~ 250
Preheating zone
Reflow zone
Cooling zone
217
150 ~ 200
60 ~ 120s
!217
60 ~ 90s
-1 ~ -5
/s
200
Soldering time
> 30s
Ramp-up zone
1 ~ 3
/s
100
50
25
Time (sec.)
0
50
100
150
200
250
0
Ramp-up zone — Temp.: <150
Time: 60 ~ 90s Ramp-up rate: 1 ~ 3
/s
Preheating zone — Temp.: 150 ~ 200
Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8
/s
Reflow zone — Temp.: >217
7LPH60 ~ 90s; Peak Temp.: 235 ~ 250
(<245
recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180
Ramp-down rate: -1 ~ -5
/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure 2: Reflow Profile
13
ESP32-WROOM-32E
UserManual
Espressif Systems
