Introduction
EP-BX5C
Page 1-3
The entire enclosed product is called the Pentium
®
II or Pentium
®
III Processor.
The packaging technology and each of the physical elements of the product are
referred to using accurate technical descriptions. This allows clear reference to
the products as just a processor. This is the model used in past packaging tech-
nologies like PGA, TCP, PQFP, DIP, etc.
S.E.C. Cartridge Terminology
•
Pentium
®
II or Pentium
®
III Processor
The new enclosed card packaging technology is called a “Single Edge
Contact cartridge.” This is similar to previous names for packaging
technology such as PGA or TCP.
•
Processor card
The green PCB (with or without components on it)
•
Processor core
The silicon on the PLGA package on the PCB
•
Cover
The plastic cover on the opposite side from the thermal plate.
•
Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium
®
Pro
processor uses Socket 8.
•
Retention mechanism
Formerly ‘retention module’ the dual posts, etc. that holds the cartridge in
place.
•
Thermal plate
The heatsink attach-
ment plate.
•
Heat sink supports
The support pieces that
are mounted on the
mainboard to provide
added support for
heatsinks.
Figure 1: Pentium
®
II/III Processor CPU
with S.E.C.C. or S.E.C.C.2 Package
Pentium
®
II Processor
in an S.E.C.C. Package
Pentium
®
III Processor
in an S.E.C.C.2 Package
