Enclustra ME-KX2-160-1C-D10, User Manual

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Module SDRAM Type Density Configuration Manufacturer
ME-KX2-D10 (commercial) MT41K128M16JT-125:K 2 Gbit 128 M × 16 bit Micron
ME-KX2-D10 (commercial) NT5CC128M16IP-DI 2 Gbit 128 M × 16 bit Nanya
ME-KX2-D11 (industrial) NT5CC256M16CP-DII 4 Gbit 256 M × 16 bit Nanya
ME-KX2-D11 (industrial) NT5CC256M16DP-EKI 4 Gbit 256 M × 16 bit Nanya
ME-KX2-D11 (industrial) NT5CC256M16ER-EKI 4 Gbit 256 M × 16 bit Nanya
ME-KX2-D11 (industrial) K4B4G1646D-BMK0 4 Gbit 256 M × 16 bit Samsung
ME-KX2-D11 (industrial) K4B4G1646E-BMMA 4 Gbit 256 M × 16 bit Samsung
ME-KX2-D11 (industrial) H5TC4G63CFR-RDI 4 Gbit 256 M × 16 bit SK Hynix
Table 20: DDR3 SDRAM Types
Warning!
Other DDR3 memory devices may be equipped in future revisions of the KX2 FPGA module.
Please check the user manual regularly for updates. Any parts with different speed bins or temperature
ranges that fulfill the requirements for the module variant may be used.
2.15.2 Signal Description
Please refer to the KX2 FPGA Module FPGA Pinout Excel Sheet [4] for detailed information on the
DDR3 SDRAM connections.
2.15.3 Termination
Warning!
No external termination is implemented for the data signals on the KX2 FPGA module.
Therefore, it is strongly recommended to enable the on-die termination (ODT) feature of the DDR3
SDRAM device.
2.15.4 Parameters
Please refer to the KX2 FPGA module reference design [2] for DDR3 settings guidelines. The DDR3
SDRAM parameters to be set in Vivado project are presented in Table 21. If the memory part equipped on
the module is not available in Vivado, a custom memory part can be created and configured as described
in the table.
The values given in Table 21 are for reference only. Depending on the equipped memory device on the
KX2 FPGA module and on the DDR3 SDRAM frequency, the configuration may be different to the
one in the reference design. Please refer to the memory device datasheet for details.
D-0000-430-002 26 / 48 Version 06, 25.07.2019