3-2
TVN_SN
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Hot-air
Flat Pack-IC
Desoldering
Machine
CBA
Flat Pack-IC
Tweezers
Masking
Tape
Fig. S-1-2
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
Fine Tip
Soldering Iron
Sharp
Pin
Fig. S-1-4
Summary of Contents for LC320EM8
Page 37: ...8 8 A71F3SCIR IR Sensor Schematic Diagram ...
Page 38: ...8 9 A71F3SCD1 Digital Main 1 9 Schematic Diagram ...
Page 43: ...8 14 Digital Main 6 9 Schematic Diagram A71F3SCD6 ...
Page 44: ...8 15 Digital Main 7 9 Schematic Diagram A71F3SCD7 ...
Page 45: ...8 16 Digital Main 8 9 Schematic Diagram A71F3SCD8 ...
Page 46: ...8 17 Digital Main 9 9 Schematic Diagram A71F3SCD9 ...
Page 51: ...8 22 Jack CBA Top View BA71F0F01021 4 ...
Page 53: ...8 24 Function CBA Top View Function CBA Bottom View BA71F0F01021 2 ...
