20020327
3-3-3
HB3J1EL
C419
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JK30B103
C422
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMAVSL470
C423
ELECTROLYTIC CAP. 220
µ
F/6.3V M H7
CE0KMAVSL221
C424
CERAMIC CAP. B K 470pF/100V or
CCD2AKP0B471
CERAMIC CAP. B K 470pF/500V
CCD2JKS0B471
C425
FILM CAP.(P) 0.018
µ
F/100V J or
CMA2AJS00183
FILM CAP.(P) 0.018
µ
F/50V J
CA1J183MS029
C450
B
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
B
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
B
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
B
CHIP CERAMIC CAP. B K 0.022
µ
F/25V
CHD1EK30B223
C451
A
PCB JUMPER D0.6-P5.0
JW5.0T
C451
B
ELECTROLYTIC CAP. 0.47
µ
F/50V M or
CE1JMASDLR47
B
ELECTROLYTIC CAP. 0.47
µ
F/50V M
CE1JMASTLR47
C452
B
ELECTROLYTIC CAP. 0.1
µ
F/50V M H7
CE1JMAVSLR10
C453
B
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C454
B
ELECTROLYTIC CAP. 2.2
µ
F/50V M H7
CE1JMAVSL2R2
C455
B
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C456
B
ELECTROLYTIC CAP. 22
µ
F/6.3V M H7
CE0KMAVSL220
C457
B
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C458
B
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMAVSL4R7
C459
B
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
B
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JK30B103
C460
B
ELECTROLYTIC CAP. 22
µ
F/6.3V M H7
CE0KMAVSL220
C461
B
CHIP CERAMIC CAP.(MELF) Y K 4700pF/
16V or
CZM1CKB0Y472
B
CHIP CERAMIC CAP.(MELF) Y K 4700pF/
16V or
CZM1CK30Y472
B
CHIP CERAMIC CAP. B K 4700pF/50V or
CHD1JKB0B472
B
CHIP CERAMIC CAP. B K 4700pF/50V
CHD1JK30B472
C462
B
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
B
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JK30B103
C463
B
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
B
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JK30B103
C464
B
ELECTROLYTIC CAP. 220
µ
F/6.3V M H7
CE0KMAVSL221
C465
B
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMAVSL4R7
C466
B
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
B
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
B
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
B
CHIP CERAMIC CAP. B K 0.022
µ
F/25V
CHD1EK30B223
C467
B
CHIP CERAMIC CAP.(MELF) Y K 4700pF/
16V or
CZM1CKB0Y472
B
CHIP CERAMIC CAP.(MELF) Y K 4700pF/
16V or
CZM1CK30Y472
B
CHIP CERAMIC CAP. B K 4700pF/50V or
CHD1JKB0B472
B
CHIP CERAMIC CAP. B K 4700pF/50V
CHD1JK30B472
C468
B
ELECTROLYTIC CAP. 22
µ
F/6.3V M H7
CE0KMAVSL220
C469
B
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
B
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JK30B103
C470
B
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMAVSL4R7
C471
B
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C472
B
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C473
B
ELECTROLYTIC CAP. 2.2
µ
F/50V M H7
CE1JMAVSL2R2
C474
B
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C475
B
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C476
B
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C477
B
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMAVSL4R7
C478
B
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C479
B
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMAVSL4R7
C480
B
ELECTROLYTIC CAP. 0.1
µ
F/50V M H7
CE1JMAVSLR10
C481
B
ELECTROLYTIC CAP. 0.1
µ
F/50V M H7
CE1JMAVSLR10
Ref. No. Mark
Description
Part No.
C482
B
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMAVSL4R7
C483
B
ELECTROLYTIC CAP. 22
µ
F/16V M H7
CE1CMAVSL220
C484
B
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMAVSL4R7
C485
B
ELECTROLYTIC CAP. 22
µ
F/16V M H7
CE1CMAVSL220
C486
B
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMAVSL4R7
C487
B
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMAVSL4R7
C488
B
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMAVSL4R7
C489
B
ELECTROLYTIC CAP. 4.7
µ
F/50V M H7
CE1JMAVSL4R7
C491
B
ELECTROLYTIC CAP. 4.7
µ
F/50V M H7
CE1JMAVSL4R7
C494
B
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
or
CZM1CZB0F103
B
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V CZM1CZ30F103
C495
B
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
or
CZM1CZB0F103
B
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V CZM1CZ30F103
C497
B
ELECTROLYTIC CAP. 47
µ
F/16V M H7
CE1CMAVSL470
C498
B
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZB0F104
B
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZB0F104
B
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V or
CHD1JZBFZ104
B
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
B
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZ30F104
B
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C500
B
CERAMIC CAP.(AX) F Z 0.1
µ
F/50V
CCA1JZTFZ104
C502
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C503
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V
CHD1EK30B223
C504A
ELECTROLYTIC CAP. 330
µ
F/6.3V M H7
CE0KMASSL331
C507
CHIP CERAMIC CAP.(MELF) SL J 22pF/50V
or
CZM1JJBSL220
CHIP CERAMIC CAP.(MELF) SL J 22pF/50V
or
CZM1JJ3SL220
CHIP CERAMIC CAP. CH J 22pF/50V or
CHD1JJBCH220
CHIP CERAMIC CAP. CG J 22pF/50V or
CHD1JJBCG220
CHIP CERAMIC CAP. CH J 22pF/50V or
CHD1JJ3CH220
CHIP CERAMIC CAP. CG J 22pF/50V
CHD1JJ3CG220
C508
CHIP CERAMIC CAP.(MELF) SL J 18pF/50V
or
CZM1JJBSL180
CHIP CERAMIC CAP.(MELF) SL J 18pF/50V
or
CZM1JJ3SL180
CHIP CERAMIC CAP. CH J 18pF/50V or
CHD1JJBCH180
CHIP CERAMIC CAP. CG J 18pF/50V or
CHD1JJBCG180
CHIP CERAMIC CAP. CH J 18pF/50V or
CHD1JJ3CH180
CHIP CERAMIC CAP. CG J 18pF/50V
CHD1JJ3CG180
C509
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V
CHD1JK30B103
C510
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JKB0B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V or
CHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V
CHD1EK30B473
C514
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V
CHD1EK30B223
C520
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
or
CZM1CZB0F103
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V CZM1CZ30F103
C522
ELECTROLYTIC CAP. 220
µ
F/6.3V M H7
CE0KMAVSL221
C529
ELECTROLYTIC CAP. 22
µ
F/10V M H7
CE1AMAVSL220
C532
CHIP CERAMIC CAP.(MELF) SL J 100pF/
50V or
CZM1JJBSL101
CHIP CERAMIC CAP.(MELF) SL J 100pF/
50V or
CZM1JJ3SL101
Ref. No. Mark
Description
Part No.