25
WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
11.2 Precious Metals (TAE and TAE-DC)
Table 12 lists precious metals for recovery. Refer to Figure 3 through Figure 11 to locate
the item numbers listed.
Table 12 Plastic Part Markings on TAE and TAE-DC Components
11.3 Plastic Part Markings (TAE and TAE-DC)
Table 13 lists markings for plastic parts that weigh more than 25 grams.
Table 13 Plastic Part Markings on TAE and TAE-DC Components
Part Name
Weight ISO 11469:2000 Marking
2.5-inch Hard Disk Drive Carrier
132 g
Lexan 3414R+40%GF
Two Power Cooling/Module Air Flappers 84 g
>PC+ABS-FR(40)<
Two LCC Assembly Air Flappers
78 g
>PC+ABS-FR(40)<
Fan Pack Assembly
268 g
>PC+ABS-FR(40)<
Material
Item
Location
Copper (Cu)
12,23
14,22
See
Power/Cooling Module
Two Coils on Top PCB
Wiring (cable sheathing, copper)
All PCBs (Circuit Etch)
Gold (Au)
Absent or not at an appreciable level
Palladium (Pd)
Absent or not at an appreciable level
Platinum (Pt)
Absent or not at an appreciable level
Silver (Ag)
Absent or not at an appreciable level
