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Intel H55 Series User's Manual
1.2 Specifications
CPU
- Supports Intel
®
Core™ i7 /Core™ i5/Core™ i3 Processors in the LGA1156
Package
- Supports Intel
®
Turbo-boost Technology
Chipset
-Intel
®
H55 Express Chipset
Main Memory
- Supports Dual Channel DDR3 1600(OC)/1333/1066
- Supports Dual Channel memory architecture
- Supports non-ECC, unbuffered memory, 2 x DIMM slots, Max. capacity up to
8GB
BIOS
- AMI BIOS
- 1 x 64 Mb Flash ROM
Rear Panel I/O
- 1 x PS/2 Mouse port
- 1 x PS/2 Keyboard port
- 1 x VGA port
- 1 x DVI port
- 1 x HDMI port
- 4 x USB 2.0 ports
- 1 x RJ45 LAN port
- 6 Channel Audio I/O
Internal I/O
Connectors
- 1 x 24-pin EPS Power connector
- 1 x 8-pin ATX 12V power connector
- 4 x SATAII 3.0 Gb/s connectors
- 2 x Fan Connectors: 1 x CPU Fan connector/ 1 x System Fan connector
- 1 x Front panel High Definition audio header
- 1 x S/PDIF In/Out header
- 1 x Front System Panel connector
- 1 x Serial port header
- 1 x Speaker header
- 2 x USB 2.0 headers for additional 4 USB 2.0 ports
Audio
-Realtek ALC662 6-Channel High-Definition Audio CODEC
Manageability
-WOL, PXE, PME Wake Up
Onboard LAN
- Realtek RTL8111DL Gigabit LAN
Expansion Slots
- 1 x PCIe Gen.2 x16 slot
- 1 x PCI Express x1 slot
- 2 x PCI slots
Form Factor
- Micro ATX form factor: 244 mm x 190 mm
