ECS A760GM-M3, User Manual, Page: 8 / 68

2
Introducing the Motherboard
Feature
Processor
HyperTransport
TM
Technology is a point-to-point link between two devices, it
enables integrated circuits to exchange information at much higher speeds than
currently available interconnect technologies.
• Accommodates AMD Phenom
TM
processor (socket AM2+)
AMD Athlon TM 64 X2 Dual-Core/Athlon TM 64/Sempron™ processors
• Supports HyperTransport
TM
(HT) 3.0 interface speeds
This motherboard uses a socket AM2+/AM2 that carries the following features:
SB710
(SB)
760G
(NB)
The AMD 760G Northbridge (NB) and SB710 Southbridge (SB) chipsets are based
on an innovative and scalable architecture with proven reliability and perfor-
mance.
Chipset
• Compliant with PCI v2.3 specification at 33 MHz
• Supports six Serial ATA devices which speeds up to 3.0
Gb/s
• Integrated USB 2.0 Host Controller supporting up to eight
USB 2.0 ports
• Integrated IDE controller supports Ultra ATA 133/100/66/
33 modes
• Supports integrated RAID 0 and RAID 1 functionalities
across all 6 ports.
Memory
• Supports DDR2 1066 (AM2+)/800/667/533 DDR2 SDRAM with Dual-
channel architecture
• Accommodates two unbuffered DIMMs
• Up to 8 GB per DIMM with maximum memory size up to 16 GB*
• One x4 A-Link Express II interface (PCI Express 1.1
compliant) for connection to an AMD Southbridge
• Supports one PCI Express x16 for Graphics Interface,
fully compliant to the PCI Express Gen 2 (version 2.0)
• Proven Radeon
TM
graphics powering DirectX
®
10
• Enhanced Digital Display integration
• Fully ACPI 2.0, OnNow, and IAPC (Instantly Available
PC) power management
• Single chip solution in 55nm, 1.1 V CMOS technology
• Integrated ATI Avivo
TM
HD
1
, Low Power Design, AMD
Cool’n’Quiet TM 2.0, ATI SurroundView TM , AMD OverDrive
This board supports CPU up to 95W TDP only.