Chengdu Ebyte Electronic Technology Co.,Ltd.
Copyright ©2012–2021
，成都亿佰特电子科技有限公司
9
5.2 Module is easy to damage
Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module;
Please check the stability of power source, the voltage cannot fluctuate too much;
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility;
Please ensure the humidity is within limited range, some parts are sensitive to humidity;
Please avoid using modules under too high or too low temperature.
5.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify
frequency and channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable;
The extension line and feeder quality are poor or too long, so the bit error rate is high.
6 Production guidance
6.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time
（
tL
）
Maintained Above
（
TL
）
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature
（
Tp
）
Peak temp.
220-235℃
230-250℃
Aveage ramp-down rate
（
Tp to Tsmax
）
Aveage ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature for
25℃
6 minutes max
8 minutes max
