Ebyte E32-400T20S, Manual

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Chengdu Ebyte Electronic Technology Co.,Ltd. E32-900M30SA User Manual
Copyright ©2012–2021
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Chengdu Ebyte Electronic Technology Co.,Ltd. 7
14 DIO3 Input/Output General IO port (see SX1276 manual for details)
15 DIO4 Input/Output General IO port (see SX1276 manual for details)
16 DIO5 Input/Output General IO port (see SX1276 manual for details)
17 GND
-
Ground
18 GND
-
Ground
19 DIO1 Input/Output General IO port (see SX1276 manual for details)
20 DIO0 Input/Output General IO port (see SX1276 manual for details)
21 NRST Input Chip reset trigger input pin
22 MISO Output SPI data output pin
23 MOSI Input SPI data output pin
24 SCLK Input SPI data output pin
25 NSS Input the module chip selects the pin used to start an SPI communication
26 GND
-
Ground
27 ANT
-
Antenna interface, Sample hole (50
Ω
characteristic impedance)
28 GND
-
Ground
4 Basic operation
4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and
the module needs to be reliably grounded;

Please pay attention to the correct connection of the positive and negative poles of the power supply,
reverse connection may cause permanent damage to the module;

Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,
the module will be permanently damaged;

Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation;

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and
other parts with large electromagnetic interference;

Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided
under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer,
and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital
part of the module and routed in the Bottom Layer;

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom
Layer or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;

It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done;