E22-400M33S User Manual
11
6.2 Module is easy to damage
Please check the power supply to ensure that it is within the recommended value. If it exceeds the maximum value,
the module will be permanently damaged;
Please check the stability of power source, the voltage cannot fluctuate too much.
Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6.3 BER is too high
There is interference from the same frequency signal nearby, stay away from the interference source or modify the
frequency and channel to avoid interference.
The clock waveform on the SPI is not standard, check whether there is interference on the SPI line, and the SPI bus
alignment should not be too long.
Unsatisfactory power supply may also cause garbled code, be sure to ensure the reliability of the power supply.
Poor quality or too long extension cable or feeder line may also cause high BER.
7. Welding work instruction
7.1 Reflow Temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Minimum preheating
temperature
100℃
150℃
Preheat temperature max (Tsmax)
Maximum preheating
temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Warm-up time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rise rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
liquid phase temperature
183℃
217℃
Time
（
tL
）
Maintained Above
（
TL
）
Time above the liquid
phase line
60-90 sec
30-90 sec
Peak temperature
（
Tp
）
Peak temperature
220-235℃
230-250℃
Aveage ramp-down rate
（
Tp to Tsmax
）
Average drop rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time from 25°C to peak
temperature
6 minutes max
8 minutes max
7.2 Reflow Profile
