nRF24L01P wireless module
E01 series user manual
Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co.,Ltd.
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take measures such as shielding to reduce the influence of harmonic interference and inter-modulation interference.
[Crystal] If there is a crystal near the circuit board on the module, increase the linear distance between the crystal and circuit board as much as
possible.
7. Production Guidance
7.1. Reflow Soldering Temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Mini. preheating temperature
100℃
150℃
Preheat temperature max (Tsmax)
Max. preheating temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rising rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquidus temperature
183℃
217℃
Time（tL）Maintained Above（TL）
The time above the liquidus
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temperature
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average rate of decline
6℃/second max
6℃/second max
Time 25℃ to peak temperature
The time from 25℃ to peak temperature
6 minutes max
8 minutes max
7.2. Reflow Curving Diagram
