Ebyte E01-ML01S User Manual Download Page 6

Chengdu Ebyte Electronic Technology Co., Ltd.                                                                                                                                        E01-ML01S User Manual   

 

Copyright ©2012–2018

Chengdu Ebyte Electronic Technology Co.,Ltd.

                                                                                                                                        

 

4.Basic operation 

4.1

 

Hardware design 

 

It is recommended  to use a DC  stabilized  power supply. The power supply ripple  factor is as small  as possible, and 
the module needs to be reliably  grounded

 

 

Please  pay  attention to  the  correct  connection of  the  positive  and  negative  poles  of  the  power  supply.  Reverse 
connection may cause permanent damage to the module

 

 

Please  check  the  power  supply to  ensure  it  is  within  the  recommended  voltage  otherwise  when  it  exceeds  the 
maximu m  value the module  will  be permanently damaged; 

 

Please check the stability of the power supply, the voltage can not be fluctuated frequently

 

 

When designing the power supply circuit for the module, it is often recommended  to reserve more  than 30%  of the 
margin,  so the whole machine is beneficial  for long-term stable operation; 

 

The module should be as far away as possible from  the power supply, transformers, high -frequency wiring  and other 
parts with large electromagnetic  interference; 

 

High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. 
If it is necessary to pass through the module,  assume that the module  is soldered t o the Top Layer,  and the copper is 
spread on the Top Layer  of the module  contact part(well  grounded), it must be close to the digital  part of the module  
and routed in the Bottom  Layer

 

 

Assuming the module is soldered or placed over the Top Layer,  it is wro ng to randomly route over the Bottom Layer 
or other layers, which will  affect the module's spurs and receiving sensitivity to varying degrees

 

 

It is assumed that there are devices with large electromagnetic interference around the module that will  greatly affect 
the performance.  It is recommended to keep them away from the module according to the strength of the interference. 
If necessary, appropriate isolation and shielding can be done

 

 

Assume that there are traces with large electromagnetic  interference  (high-frequency digital,  high-frequency analog, 
power traces) around the module  that will  greatly affect  the performance  of  the module.  It  is recommended  to stay 
away from  the module  according to the strength of the interference. If  necessary, appropriate isolation and shielding 
can be done. 

 

If the communication  line  uses a 5V  level, a 1k-5.1k  resistor must be connected in series (not recommended,  there is 
still a risk of damage)

 

 

Try to stay away from  some physical layers such as TTL protocol at 2.4GHz  ,  for example:  USB3.0

 

 

The mounting structure of antenna has a great influence on the performance  of the module.  It is necessary to ensure 
that the antenna is exposed, preferably vertically  upward. When the module  is mounted inside the case, use a good 
antenna extension cable to extend the antenna to the outside

 

 

The antenna must not be installed  inside  the metal  case, which  will  cause the transmission distance to be greatly 
weakened. 

 

Conductors or other sources of interference should be avoided around the on board PCB  antenna. 

 

Summary of Contents for E01-ML01S

Page 1: ...E01 ML01S User Manual nRF24L01P 2 4GHz SMD Wireless Module...

Page 2: ...2 2 Operating parameter 3 3 Size and pin definition 4 4 Basic operation 5 4 1 Hardware design 5 4 2 Software editing 6 5 Basic application 6 5 1 Basic circuit diagram 6 6 FAQ 7 6 1 Communication rang...

Page 3: ...Communication distance tested is up to 100m Maximum transmission power of 1mW software multi level adjustable Support air date rate of 2Mbps 1Mbps 250kbps 125 communication channels to meet the needs...

Page 4: ...5V TTL it may be at risk of burning down Operating temperature 40 5 Industrial design Operating frequency MHz 2 4 2 525 Support ISM band Power consumption TX current mA 13 Instant power consumption RX...

Page 5: ...Co Ltd 4 3 Size and pin definition Pin No Pin item Pin direction Pin application 1 VCC Power supply must be20 3 6V 2 CE Input Chip Enable 3 CSN Input SPI Chip select 4 SCK Input SPI clock 5 MOSI Inpu...

Page 6: ...and routed in the Bottom Layer Assuming the module is soldered or placed over the Top Layer it is wrong to randomly route over the Bottom Layer or other layers which will affect the module s spurs and...

Page 7: ...ransmit and receive function For the timing operation of the module register read and write operations please refer to the latest nRF24L01P data sheet As interrupt pin for IRQ it can be used to wake u...

Page 8: ...5V the lower the voltage the lower the transmitting power Due to antenna quality or poor matching between antenna and module 6 2 Module is easy to damage Please check the power supply source ensure i...

Page 9: ...preheating temp 150 200 Preheat Time Tsmin to Tsmax ts Preheating time 60 120 sec 60 120 sec Average ramp up rate Tsmax to Tp Average ramp up rate 3 second max 3 second max Liquidous Temperature TL Li...

Page 10: ...ge Antenna Hz dBm km E01 ML01S nRF24L01P 2 4G 0 0 1 SMD PCB E01 ML01D nRF24L01P 2 4G 0 0 1 DIP PCB E01 ML01IPX nRF24L01P 2 4G 0 0 2 SMD IPEX E01 ML01DP4 nRF24L01P 2 4G 20 1 8 DIP PCB E01 ML01DP5 nRF24...

Page 11: ...ginal version huaa 1 10 2018 5 22 Content updated huaa 1 20 2019 4 2 ModelNo split molly About us Technical support support cdebyte com Documents and RF Setting download link www ebyte com Thank you f...

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