Chengdu Ebyte Electronic Technology Co., Ltd
E01C-ML01D User Manual
7
7.Soldering guidance
7.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb
Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Min preheating temp.
100
℃
150
℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
Liquid phase temp.
183
℃
217
℃
Time
（
tL
）
Maintained Above
（
TL
）
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature
（
Tp
）
Peak temp.
220-235
℃
230-250
℃
Aveage ramp-down rate
（
Tp to Tsmax
）
Average ramp-down rate
6
℃
/second max
6
℃
/second max
Time 25
℃
to peak temperature
Time to peak temperature for
25
℃
6 minutes max
8 minutes max
7.2 Reflow soldering curve
