Package Description
5-4
TSEV81102G0FS Evaluation Board User Guide
0974C–BDC–02/09
e2v semiconductors SAS 2009
5.3
CQFP 196
Outline
Dimensions
Package: black AI203 ceramic
Leads: Kovar, Ni and Au plating
Lid: Kovar, Ni and Au plating
Heat spreader on the bottom: CuW with Ni and Au plating
Figure 5-2.
CQFP 196 Package Top View
18.54 mm
18.54 mm
Pin 1 Index
0.230 mm + 0.050/-0.038
lead width (196x)
0.635 mm
pitch
Chamfer 0.5 ±0.25
Lands for Capacitor
(Chip size 0603)
Chamfer 0.76 ±0.25 (x3)
33.91 mm ±0.10 mm
38.80 mm ±0.18 mm
33.91 mm ±0.10 mm
38.80 mm ±0.18 mm
