IRDA-WELDER TX-999
user manual
use the vacuum nozzle or tweezers to take the chip away, and close the
infrared lamp body and the preheating chassis and so on. Turn off the
power off after complete cooling.
Attention
:
When the chip spreads has the waterproof solid sealing compound,
must first open the preheating chassis to melt rubber. The melt rubber
temperature should not be excessively high, generally for 120-140
℃
,
according to sol temperature which the factory provides, carries on sol
processing, for suitable, preheat interval 3 - 5 minutes or longer, after
rubber being heated soften or the pulverization, clean it up, also can use
sol hydrosol and so on other measures. Must pay attention to control the
temperature during the welding, avoiding to move the sensor lead to the
measuring temperature is not exact. And avoiding heating the chip for
long time, the temperature is too high, or the chip will be broken.
(3). Reflow operation process:
The process is basically the same to the sealing off process. The
difference is: first clean the pad, then reballing, preheat the PCB board,
and correct laying aside chip, according to the tin ball welding
temperature to preheat, weld and cool.
May enhance temperature 20-30C regarding the non-lead solder
component
3.
Caution and related introduction
：
http://www.puhuit.com/
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