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© 2010 DiZiC Co. Ltd, 3F, N° 4-2 Jin Xi Street Taipei City 104, TAIWAN   

 

 

 

Email: 

info@dizic.com

 | Web: 

www.dizic.com

 

All Rights Reserved. All trademarks are property of their respective owners. Subject to change without notice. 
Document ID: PB-ZB-MOD-003-20DS

 

 

 

2 

 

M

ODULE 

V

ARIANTS

 

2.1 

  

I

NTRODUCTION

 

The  DZ-ZB  is  low-power,  high  sensitivity  IEEE  802.15.4  /  ZigBee-compliant  module.  This  multi-functional  device  based  on 
STMicroelectronics STM32W108 fully integrated System-on-Chip [1]. The STM32W108 integrates a 2.4 GHz, IEEE 802.15.4-
compliant  transceiver,  32-

bit  ARM®  Cortex™-M3  microprocessor,  Flash  and  RAM  memory,  and  peripherals  of  use  to 

designers  of  ZigBee-based  systems  [2].    Block  diagrams  of  DZ-ZB  Module  is  show  on  Figure  2.1  and  utilizes 
STM32W108CBU6x version of the high performance, IEEE 802.15.4 compliant, wireless system-on-chip STM32W108 family. 

 

 

 

Fig. 2.1 

Block diagram of DZ-ZB Modules

 

 
 

DZ-ZB  modules  are  available  in  two  different  product  lines:  without/with  PA/LNA  Front-End  (FE).  Both  product  lines 
offering  three  ZigBee  stack  configurations.  The  first  decision  you  need  to  make  is  if  you  want  the  Output  option.  The 
following options are available: 

 

A  - Embedded SMD Antenna  

 

P  - Single ended 50 Ohm RF Pad 

 

U  - U.FL 50 Ohm coaxial connector 

The second decision you need to make is Power level option. The following options are available: 

 

S  - St 7dBm 

 

R  - Front End (PA and LNA) with RF output power level de 20 dBm 

 

T  - Front End (PA and LNA) + 20 dBm 

The third decision you need to make ZigBee stack. The following options are available: 

 

F  - RF4CE stack 

 

X  - Proprietary stack 

 

Z  - EmberZnet PRO stack 

The final decision is level of electromagnetic immunity (EMI) protection. The following options are available: 

 

M  - Metal cap shielding enabling enhanced level of electromagnetic immunity (EMI) protection 

 

S  -  Standard, without metal shielding cap 

 

The next chapters will explain each of all options.

 

 

2.2 

  

D

I

Z

I

C

 

802.15.4

 

RF

 

M

ODULE

:

 

O

UTPUT 

O

PTIONS

 

The following Output Options are available: 

 

A  - Embedded SMD Antenna  

 

P  - Single ended 50 Ohm RF Pad 

 

U  - U.FL 50 Ohm coaxial connector

 

Summary of Contents for STM32W RF

Page 1: ...vides additional filters or for connecting to another 50 Ohm coaxial cable TX line The single port 50 Ohm RF pad allows for a direct connection to another board application module or external antenna Software Stack Options Choose from EmberZNet PRO RF4CE or a low level PHY MAC stack EmberZNet PRO is an easy to use ZigBee platform for complex mesh networks RF4CE Radio Frequency for Consumer Electro...

Page 2: ...EM ON CHIP 6 3 2 RF FRONT END WITH RF OUTPUT POWER LEVEL DETECTOR 7 3 3 RF FRONT END 8 3 4 ZIGBEE STACKS 8 4 ELECTRICAL CHARACTERISTICS 9 4 1 PARAMETER CONDITIONS 9 4 1 1 Minimum and maximum values 9 4 1 2 Typical values 9 4 2 ABSOLUTE MAXIMUM RATINGS 9 4 3 OPERATING CONDITIONS 10 4 3 1 General operating conditions 10 4 3 2 Electrostatic discharge ESD 10 4 4 DC CHARACTERISTICS 11 4 5 RF CHARACTERI...

Page 3: ...A 800 nA with without sleep timer Low frequency internal RC oscillator for low power sleep timing High frequency internal RC oscillator for fast 100 µsec processor start up from sleep Innovative network and processor debug Serial Wire JTAG interface Standard ARM debug capabilities Flash Patch Breakpoint Data Watch point Trace Instrumentation Trace Macrocell Exceptional RF Performance Normal mode L...

Page 4: ...ent product lines without with PA LNA Front End FE Both product lines offering three ZigBee stack configurations The first decision you need to make is if you want the Output option The following options are available A Embedded SMD Antenna P Single ended 50 Ohm RF Pad U U FL 50 Ohm coaxial connector The second decision you need to make is Power level option The following options are available S S...

Page 5: ... Chip where radio microcontroller program user memory RAM ZigBee protocols stack are integrated in one chip Option T Front End PA and LNA 20 dBm STM32W chip System on Chip where radio microcontroller program user memory RAM ZigBee protocols stack are integrated in one chip 2 4 DIZIC 802 15 4 RF MODULE STACK OPTIONS The following ZigBee stack options are available Option F RF4CE stack Option X Prop...

Page 6: ...ion Including an integrated MPU it supports two different modes of operation System mode and Application mode The networking stack software runs in System mode with full access to all areas of the chip Application code runs in Application mode with limited access to the STM32W108 resources this allows for the scheduling of events by the application developer while preventing modification of restri...

Page 7: ...tecture integrates the PA LNA Transmit and Receive switching circuitry the associated matching network and the harmonic filter all in a BiCMOS single chip device Combining superior performance high sensitivity and efficiency low noise small form factor and low cost is the perfect solution for applications requiring extended range and bandwidth and can result in a potential 10x range increase The R...

Page 8: ...is shown below Fig 3 3 Block diagram of the module with front end Power level option T Functional description of the signals controlling front end are summarized in table 3 2 below Table 3 2 Functional description of the Front End signals FE Signal name Direction Description STM32W108 port name TxRx Digital input to FE When ENABLE 1 TxRx 1 Transmit Mode TxRx 0 Receive Mode PC5 TX_ACTIVE HIGH_GAIN ...

Page 9: ...es and are not tested Typical ADC accuracy values are determined by characterization of a batch of samples from a standard diffusion lot over the full temperature range 4 2 ABSOLUTE MAXIMUM RATINGS Stresses above the absolute maximum ratings listed in Table 4 1 Voltage characteristics Table 4 2 Current characteristics and Table 4 3 Thermal characteristics may cause permanent damage to the device T...

Page 10: ...ostatic discharges a positive then a negative pulse separated by 1 second are applied to the pins of each sample according to each pin combination The sample size depends on the number of supply pins in the device 3 parts n 1 supply pins This test conforms to the JESD22 A114 C101 standard Table 4 5 ESD absolute maximum ratings Symbol Ratings Conditions Class Maximum value Unit VESD HBM Electrostat...

Page 11: ...1 5 6 5 1 8 μA 85 C VDD_PADS 3 6 V 2 μA Simulated deep sleep debug mode current With no debugger activity 200 μA Reset current Quiescent current nRESET asserted Typical at 25 C 3 V Max at 85 C 3 6 V 1 2 1 2 1 2 mA Processor and peripheral currents ARM Cortex M3 RAM and flash memory 25 C 1 8 V memory and 1 25 V core ARM Cortex M3 running at 12 MHz from crystal oscillator Radio and all peripherals o...

Page 12: ...2 mA Boost mode total RX current Radio receiver MAC and baseband CPU IRAM and Flash memory VDD_PADS 3 0 V 25 C ARM Cortex M3 running at 12 MHz 28 35 32 mA VDD_PADS 3 0 V 25 C ARM Cortex M3 running at 24 MHz 29 36 33 mA Tx current Radio transmitter MAC and baseband 25 C and 1 8 V core max power out 3 dBm typical ARM Cortex M3 sleeping 26 136 138 mA Total Tx current Radio transmitter MAC and baseban...

Page 13: ...4 dBm Co channel rejection IEEE 802 15 4 signal at 82 dBm 6 dBc Relative frequency error 2 x 40 ppm required by IEEE 802 15 4 120 120 ppm Relative timing error 2 x 40 ppm required by IEEE 802 15 4 120 120 ppm Linear RSSI range As defined by IEEE 802 15 4 40 dB RSSI Range 90 30 dBm 4 5 2 Transmitter Table 4 8 Transmitter characteristics Parameter Conditions Typical value for module Power Level Opti...

Page 14: ...om All Rights Reserved All trademarks are property of their respective owners Subject to change without notice Document ID PB ZB MOD 003 20DS 5 MECHANICAL CHARACTERISTICS 5 1 MODULE PAD DIAGRAM Module pad connection diagram is depicted below top view Fig 5 1 Pad connection diagram for modules top view ...

Page 15: ...8 8 PC7 I O Digital I O OSC32A I O 32 768 kHz crystal oscillator Select analogue function with GPIO_PCCFGH 15 12 OSC32_EXT I Digital 32 kHz clock input source 9 PA7 I O High current Digital I O Disable REG_EN with GPIO_DBGCFG 4 TIM1CH4 O Timer 1 Channel 4 output Enable timer output with TIM1_CCER Select alternate output function with GPIO_PACFGH 15 12 Disable REG_EN with GPIO_DBGCFG 4 I Timer 1 Ch...

Page 16: ...ect alternate output function with GPIO_PACFGL 3 0 I Timer 2 channel 1 input Disable remap with TIM2_OR 4 SC2MOSI O SPI master data out of Serial Controller 2 Either disable timer output in TIM2_CCER or enable remap with TIM2_OR 4 Enable master with SC2_SPICFG 4 Select SPI with SC2_MODE Select alternate output function with GPIO_PACFGL 3 0 I SPI slave data in of Serial Controller 2 Enable slave wi...

Page 17: ...enable remap with TIM2_OR 5 Enable trace interface in ARM core Select alternate output function with GPIO_PACFGL 15 12 TIM2_CH2 see also Pad 21 O Timer 2 channel 2 output Disable remap with TIM2_OR 5 Enable timer output in TIM2_CCER Select alternate output function with GPIO_PACFGL 15 12 I Timer 2 channel 2 input Disable remap with TIM2_OR 5 17 PA4 I O Digital I O ADC4 Analog ADC Input 4 Select an...

Page 18: ...alternate output function with GPIO_PACFGL 7 4 I Timer 2 channel 1 input Disable remap with TIM2_OR 4 21 PB2 I O Digital I O SC1MISO I SPI master data in of Serial Controller 1 Select SPI with SC1_MODE Select master with SC1_SPICR SC1MOSI I SPI slave data in of Serial Controller 1 Select SPI with SC1_MODE Select slave with SC1_SPICR SC1SCL I O TWI clock of Serial Controller 1 Either disable timer ...

Page 19: ...alog function with GPIO_PBCFGL 3 0 Enable reference output with an STM system function IRQA I External interrupt source A TRACECLK see also Pad 16 O Synchronous CPU trace clock Enable trace interface in ARM core Select alternate output function with GPIO_PBCFGL 3 0 TIM1CLK I Timer 1 external clock input TIM2MSK I Timer 2 external clock mask input 28 GND Power Ground supply pad 29 PC1 I O Digital I...

Page 20: ...I O ADC1 Analog ADC Input 1 Enable analog function with GPIO_PBCFGH 11 8 IRQB I External interrupt source B TIM1_CH1 O Timer 1 channel 1 output Enable timer output in TIM1_CCER Select alternate output function with GPIO_PBCFGH 11 8 I Timer 1 channel 1 input Cannot be remapped 33 PB5 I O Digital I O ADC0 Analog ADC Input 0 Enable analog function with GPIO_PBCFGH 7 4 TIM2CLK I Timer 2 external clock...

Page 21: ...oper solder connection to the PCB Please note module can be soldered only once Reflow Profile Fig 6 1 Reflow profile 6 2 PROFILE PARAMETERS The following table 6 1 contains the temperature profile parameters Important note module should be processed according to recommended temperature profile only one time Table 6 1 Solder Reflow Parameters Parameter Value Average Ramp Up Rate from Tsoakmax to Tp...

Page 22: ...n Fig 6 2 Fig 6 2 Recommended footprint for modules top view For the modules with output option A with Embedded SMD Antenna it is important to prevent presence of any conductive materials in proximity of the module s antenna This requirement is valid for copper traces ground planes wires and connectors too Recommended Copper Keep Out area where presence of copper and any conductive material too sh...

Page 23: ...le DZ ZB P O S E Manufactured by DiZiC ZigBee Module Power level options S Standard 7dBm R Front End with RF Output Power Level Detector 20 dBm T Front End 20 dBm Output options A Embedded SMD Antenna P Single ended 50 Ohm RF Pad U U FL 50 Ohm coaxial connector Stack options F RF4CE stack X Proprietary stack Z EmberZNet PRO stack Electromagnetic Interference EMI protection options S Standard witho...

Page 24: ...ut Output HAL Hardware Abstraction Layer HBM Human Body Model HF High Frequency HVAC Heating Ventilating and Air Conditioning I C Inter Integrated Circuit bus IEEE Institute of Electrical and Electronics Engineers IRQ Interrupt Request ISM Industrial Scientific and Medical radio band ITM Instrumentation Trace Macrocell JTAG Joint Test Action Group digital interface for debugging of embedded device...

Page 25: ... 802 15 4 wireless system on chip Preliminary data 01 Mar 2010 Rev 4 3 RN0034 Release notes STM32W108xx starter and extension kits EmberZNet 4 0 2 GA Doc ID 16225 16 Feb 2010 Rev 2 4 RN0047 Release notes STM32W108xx starter and extension kits ZigBee RF4CE Doc ID 17098 23 Feb 2010 Rev 1 5 RN0046 Release note STM32W108xx starter and extension kits for Simple MAC library Doc ID 16996 04 March 2010 Re...

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