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DIGITAL-LOGIC AG

 

 

SMA200 Manual V1.0 

 

 

1.9.  Applicable Documents and Standards 

The  following  publications  are  used  in  conjunction  with  this  manual.  When  any  of  the  referenced 
specifications  are  superseded  by  an  approved  revision,  that  revision  shall  apply.  All  documents  may  be 
obtained from their respective organizations. 

  Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright 

©  1996-2003  Compaq  Computer  Corporation,  Intel  Corporation,  Microsoft  Corporation,  Phoenix 
Technologies Ltd., Toshiba Corporation. All rights reserved. 

http://www.acpi.info/

  

  ANSI/TIA/EIA-644-A-2001:  Electrical  Characteristics  of  Low  Voltage  Differential  Signaling  (LVDS) 

Interface Circuits, January 1, 2001. 

http://www.ansi.org/

  

  ANSI INCITS 361-2002: AT Attachment with Packet Interface - 6 (ATA/ATAPI-6), November 1, 2002. 

http://www.ansi.org/

  

  ANSI  INCITS  376-2003:  American  National  Standard  for  Information  Technology  –  Serial  Attached 

SCSI (SAS), October 30, 2003. 

http://www.ansi.org/

  

  Audio Codec ’97 Revision 2.3 Revision 1.0, April 2002 Copyright © 2002 Intel Corporation. All rights 

reserved. 

http://www.intel.com/labs/media/audio/

  

  Display  Data  Channel  Command  Interface  (DDC/CI)  Standard  (formerly  DDC2Bi)  Version  1,  August 

14,  1998  Copyright  ©  1998  Video  Electronics  Standards  Association.  All  rights  reserved. 

http://www.vesa.org/summary/sumddcci.htm

  

  ExpressCard Standard Release 1.0, December 2003 Copyright © 2003 PCMCIA. All rights reserved. 

http://www.expresscard.org/

 

  IEEE  802.3-2002,  IEEE  Standard  for  Information  technology,  Telecommunications  and  information 

exchange  between  systems–Local  and  metropolitan  area  networks–Specific  requirements  –  Part  3: 
Carrier  Sense  Multiple  Access  with  Collision  Detection  (CSMA/CD)  Access  Method  and  Physical 
Layer Specifications. 

http://www.ieee.org

  

  IEEE 802.3ae (Amendment to IEEE 802.3-2002), Part 3: Carrier Sense Multiple Access with Collision 

Detection (CSMA/CD) Access Method and Physical Layer Specifications, Amendment: Media Access 
Control  (MAC)  Parameters,  Physical  Layers,  and  Management  Parameters  for  10  GB/s  Operation. 

http://www.ieee.org

  

  Intel  Low  Pin  Count  (LPC)  Interface  Specification  Revision  1.1,  August  2002  Copyright  ©  2002  Intel 

Corporation. All rights reserved. 

http://developer.intel.com/design/chipsets/industry/lpc.htm

  

  PCI  Express  Base  Specification  Revision  1.1,  March  28,  2005,  Copyright  ©  2002-2005  PCI  Special 

Interest Group. All rights reserved. 

http://www.pcisig.com/

  

  PCI Express Card Electromechanical Specification Revision 1.1, March 28, 2005, Copyright © 2002-

2005 PCI Special Interest Group. All rights reserved. 

http://www.pcisig.com/

  

  PCI Local Bus Specification Revision 2.3, March 29, 2002 Copyright © 1992, 1993, 1995, 1998, 2002 

PCI Special Interest Group. All rights reserved. 

http://www.pcisig.com/

  

  PCI-104 Specification, Version V1.0, November 2003. All rights reserved. 

http://www.pc104.org

  

  PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004, 

PCI  Industrial  Computer  Manufacturers  Group  (PICMG®),  401  Edgewater  Place,  Suite  500, 
Wakefield, MA 01880, USA, Tel: 781.224.1100, Fax: 781.224.1239. 

http://www.picmg.org/

  

  Serial ATA: High Speed Serialized AT Attachment Revision 1.0a January 7, 2003 Copyright © 2000-

2003,  APT  Technologies,  Inc,  Dell  Computer  Corporation,  Intel  Corporation,  Maxtor  Corporation, 
Seagate Technology LLC. All rights reserved. 

http://www.sata-io.org/

  

Summary of Contents for SmartCore Express SMA200

Page 1: ...TECHNICAL USER MANUAL FOR smartCore Express SMA200 Nordstrasse 11 F CH 4542 Luterbach Tel 41 0 32 681 58 00 Fax 41 0 32 681 58 01 Email support digitallogic com Homepage http www digitallogic com...

Page 2: ...he original equipment manufacturer OEM who plans to build computer systems based on the single board MICROSPACE PC It is for integrators and programmers of systems based on the MICROSPACE Computer fam...

Page 3: ...the smartCoreExpress Module 16 3 3 Connector Placement Pin Definition on the Carrier Board 17 3 4 Photo of the Top Side of the PCB 18 3 5 Dimensions of the Carrier Board Connector 19 3 6 Component He...

Page 4: ...y implied warranty of merchantability or fitness for any particular purpose DIGITAL LOGIC AG shall under no circumstances be liable for incidental or consequential damages or related expenses resultin...

Page 5: ...Material Authorization number in the Support Center at http support digitallogic ch All other customers must contact their local distributors for returning defective materials This limited warranty d...

Page 6: ...mage to your equipment Warning ESD Sensitive Device This symbol and title inform that electronic boards and their components are sensitive to Electro Static Discharge ESD In order to ensure product in...

Page 7: ...between systems Local and metropolitan area networks Specific requirements Part 3 Carrier Sense Multiple Access with Collision Detection CSMA CD Access Method and Physical Layer Specifications http ww...

Page 8: ...f piggybacks or peripherals Serious electrical shock hazards can exist during all installation repair and maintenance operations with this product Therefore always unplug the power cable and any other...

Page 9: ...the supplier indicating that their production processes and resulting devices are RoHS compliant 2 If there is any doubt of the RoHS compliancy the concentration of the previously mentioned substances...

Page 10: ...ity and Management Systems SQS provides certification and assessment services for all types of industries and services SQS certificates are accepted worldwide thanks to accreditation by the Swiss Accr...

Page 11: ...ul though low consumption ATOM CPU Soldered DDR2 RAM 512k up to 2GByte Single 220pin connectors Tyco for the smartCoreExpress BUS 5x x1 PCI Express lanes 8x USB V2 0 1x PATA or 4x SATA plus 1x GE LAN...

Page 12: ...Controller Hub Memory Controller Specification Supports Socket DDR2 soldered memory Technologies DDR2 667 Capacity 512MByte up to 2GByte Voltage 1 8V Termination 0 9V Width 64bit ECC Support No Intel...

Page 13: ...oller Atmel Power Modes S5 S3 ACPI V3 0 BUS Specification LPC 8bit 33MHz PCIexpress 2x x1 lane Power Supply Specification DC Input 5 0V max 200mV ripple Inrush Current 5 0V up to 2Amp for 100 s Standb...

Page 14: ...4kV 50 Ohm Ts 5ns Grade 2 1KV Supply 500 I O 5Khz SIR Surge Immunity Requirements IEC 801 5 IEEE587 VDE 0843 Part 5 Supply 2kV 6 pulse minute I O 500V 2 pulse minute FD CRT None High Frequency Radiati...

Page 15: ...nsor Intel Atom Processor CPU power supply Power Management Microcontroller FSB 1 GB DDR2 RAM Firmware Hub BIOS System Controller Hub US15W Module Connector 220 pin FSB SMB LVDS Backlight DDC SVDO GMB...

Page 16: ...ful The maximum depth the screws can go into the product is 3mm or the module will be destroyed 3 2 Dimensions of the smartCoreExpress Module 58 0 3 25 58 5mm A1 B1 3 25 3 25 3 65mm View of the bottom...

Page 17: ...nt Pin Definition on the Carrier Board View of the Top Side mounting side of the smartCoreExpress PCB d 2 2 D 4 5 3 6mm A1 A2 A3 B1 A110 B110 0 5 0 3 1 8 1 6 0 4 d 1 0 d 1 6 58 5mm 57 7mm 1 6 d 2 2 D...

Page 18: ...DIGITAL LOGIC AG SMA200 Manual V1 0 18 3 4 Photo of the Top Side of the PCB Pin 1 65mm 58mm...

Page 19: ...DLAG Part Nr 807138 AMP Tyco 8 6318491 6 Components placed below the smartModule should total a maximum of 2 0mm 3 6 Component Heights between Module and Carrier Board Parts mounted on the back side...

Page 20: ...t I 5V Input 5V tolerant I O 3 3VSB Input 3 3V tolerant active in standby state O 3V Output 3 3V signal level O 5V Output 5V signal level P Power input output D Differential signal pair DDC Display da...

Page 21: ...A23 SDVO_GREEN_P SDVO Dif AC B23 SDVO_BLUE_P SDVO Dif AC A24 SDVO_TVCLK_N SDVO Dif AC B24 SDVO_STALL_N SDVO Dif AC A25 SDVO_TVCLK_P SDVO Dif AC B25 SDVO_STALL_P SDVO Dif AC A26 GND B26 GND A27 SDVO_RE...

Page 22: ...3 3V A79 LPC_FRAME LPC 3 3V B79 LPC_AD2 LPC 3 3V A80 GND B80 GND A81 SD_WP SDIO 3 3V B81 SD_DATA7 SDIO 3 3V A82 SD_CD SDIO 3 3V B82 SD_PWR SDIO 3 3V A83 SD_CLK SDIO 3 3V B83 SD_DATA2 SDIO 3 3V A84 SD...

Page 23: ...DIGITAL LOGIC AG SMA200 Manual V1 0 23 5 SIGNAL DESCRIPTIONS OF THE SMARTCOREEXPRESS 5 1 Wire Design for Typical Impedances 5 2 Matching of the Differential Pairs...

Page 24: ...DIGITAL LOGIC AG SMA200 Manual V1 0 24 5 3 Placing an AC Coupling Capacitor on each PCIe TX In the smartCoreExpress module all PCI TX pairs already include the series AC capacitors...

Page 25: ...n AC coupling capacitor Series Cap 100nF As 0402 200 100 0 2 PCIe_CLK 0 4 PCIe Dif Out Reference clock 100MHz Connected to a Refclock pin pair of the device 200 100 0 2 PCIe_REQ 0 4 PCIe 3 3V In A low...

Page 26: ...VO converter chip 100 100 0 5 SDVO_Red SDVO Dif Out Needs a series 100nF capacitor to connect to an SDVO converter chip 100 100 0 5 SDVO_Green SDVO Dif Out Needs a series 100nF capacitor to connect to...

Page 27: ...Out Connected to the LVDS display s PWM based backlight inverter module No multi bus master mode is supported 150 55 LVDS_BKLEN LVDS 3 3V Out Connected to the LVDS display s backlight inverter module...

Page 28: ...ded Max Length in mm Ohm Matched Length in mm USB_ 0 7 USB Dif Differential USB data signal pair 300 100 0 2 USB_OC 0 7 USB 3 3V In USB overcurrent signal PU 10k to 3 3V 300 55 If the signals are not...

Page 29: ...ATA device 100 55 PATA_DACK CMOS 5V Out IDE control signal Connect directly to the PATA device 100 55 PATA_CS 3 1 CMOS 5V Out IDE control signal Connect directly to the PATA device 100 55 PATA_REQ CMO...

Page 30: ...ice 100 55 LPC_AD 3 0 CMOS 3 3V I O Connect to the LPC device 100 55 LPC_SERIRQ CMOS 3 3V I O Connect to the LPC device PU 10k to 3 3V 100 55 LPC_CLKOUT 0 1 CMOS 3 3V Out Connect to the Firmware hub o...

Page 31: ...nnect to the SMB device open drain PU 4 7k to 3 3V 200 55 SMB_CLOCK CMOS 3 3V I O Connect to the SMB device open drain PU 4 7k to 3 3V 200 55 If the signals are not used The pins can stay open Remarks...

Page 32: ...signals for the external codecs Series 33 200 55 HAD_SYNC CMOS 3 3V Out Sample rate at 48kHz to the codecs Series 33 200 55 HAD_BITCLK CMOS 3 3V Out 24MHz signal for the external codec Series 33 200...

Page 33: ...ard Series 47 Ohm Series 49 Ohm 100 55 SD0_CMD CMOS 3 3V I O Connects to the pin of the SD SDIO device or card PU 10k to 3 3V Series 47 100 55 SD_Data 3 0 CMOS 3 3V Connects to the pin of the SD SDIO...

Page 34: ...hm Matched Length in mm SPI_MISO CMOS 3 3V In Connect to the SPI device 150 55 SPI_MOSI CMOS 3 3V Out Connect to the SPI device 150 55 SPI_CLK CMOS 3 3V Out Connect to the SPI device f 17 86 and 31 25...

Page 35: ...ATA receiver pair Series 10nF 100 100 If the signals are not used Unused SATA interfaces may be open Remarks The 10nF capacitors 0402 need to be placed directly at the SATA connector Maximum via count...

Page 36: ...f GLAN reference clock pair 33 Ohm 250 50 LCI_TXD 2 0 LCI 3 3V Out 3x TX signal for 10 100MB 250 50 LCI_RXD 2 0 LCI 3 3V In 3x RX signal for 10 100MB 250 50 LCI_RST LCI 3 3V Out LAN reset synch 250 50...

Page 37: ...Description On Module Termination Ext Ter mination Needed Max Length in mm Ohm Matched Length in mm CAN_TX CMOS 3 3V Out Serial output Res CAN_RX CMOS 3 3V In Serial input Res If the signals are not u...

Page 38: ...ystem this input must be pulled to GND PU 10k to 3 3V RST_OUT CMOS 3 3V Out Goes low during the reset phase and stays at high in the running phase Power Good CMOS 3 3V In High feedback from the extern...

Page 39: ...On Module Termination Ext Ter mination Needed Max Length in mm Ohm Matched Length in mm 5Volt PWR In 5V power supply input Switched with the sus4signal 5V Always PWR In 5V Always available VCCRTC PWR...

Page 40: ...Electrical Insulation Resistance 500M Mating Cycles 30 Connector Mating Force 0 9N per contact Connector Un mating Force 0 1N per contact Pitch 0 5mm Number of pins 220 Mechanical Temperature rating...

Page 41: ...press Type 2 Small form factor NanoETXexpress COMexpress Type 1 Q Seven Size mm 58 x 65 3770mm2 h 5 6mm 95 x 125 11875mm2 h 8 13mm 95 x 95 9025mm2 h 5 13mm 51 x 80 4080mm2 h 5 13mm 70 x 70 4900mm2 h 1...

Page 42: ...10 M Manual How to Use It 2 Matching of the Differential Pairs 23 O Ordering Codes 14 P Photo of the Top Side of the PCB 18 Pin Definition 17 Power Management 13 Power Supply 13 R Recycling Informatio...

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