DIGITAL-LOGIC MSM800BEV, Technical User'S Manual

Page: 93 / 120

DIGITAL-LOGIC AG
MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7
93
10. T
HERMAL
S
PECIFICATIONS
The temperature is specified by 90°C for the BGA case. The table shows the allowable ambient temperature
at various airflows and with different heat sink configurations.
CPU: LX800 / T (case) = 90°C / Power consumption: 5W
Photo of heat sink
H
e
a
t
s
in
k
t
y
p
e
P
a
rt
N
r.
P
ro
d
u
c
t
M
S
M
8
0
0
…
C
P
U
F
re
q
u
e
n
c
y
[M
H
z
]
A
ir
T
e
m
p
e
ra
tu
re
(a
m
b
ie
n
t)
T
c
a
s
e
:
N
o
A
ir
fl
o
w
0
m
/s
e
c
T
c
a
s
e
:
A
ir
fl
o
w
3
m
/s
e
c
T
c
a
s
e
:
A
ir
fl
o
w
6
m
/s
e
c
SEV
SEL
500 - - - -
BEV 500 85°C - - -
Thermo-
junction
807043
( see
Notes
below
)
XEV
XEL
500 85°C - - -
SEV
SEL
500 - - - -
BEV 500 85°C 110°C 100°C 95°C
Large
807042
XEV
XEL
500 70°C 100°C 90°C 80°C
Small
807041
All
MSM800s
500 70°C 100°C 90°C 80°C
No
heat sink
All
MSM800s
500 60°C 90°C
Notes…
1. This thermojunction has been specifically designed by DLAG in almost 2 separate parts to
provide distinct heat dissipation for the CPU and the other onboard chips.
2. The holes in the thermojunction are for ø2mm screws. The holes in the casing/housing that will
be attached to the thermojunction should be ø2.5 or 3mm.