Specifications for the ConnectCore 6 Plus
Environmental specifications
ConnectCore 6 Plus Hardware Reference Manual
90
Host PCB footprint
Note
Minimum thickness of the host board shall be 2 mm.
Environmental specifications
The i.MX6QP thermal specification is based on maximum junction temperature (Tj) of the specific
application processor variant used. In order to support thermal management assistance through
software, the i.MX6QP processor has a built-in junction temperature sensor/monitor.
The table below outlines the three temperature-related operational threshold modes with severity
related recovery actions as defined in software.
Mode
Temperature (Tj)
Recovery action
Critical
> Max Tj - 5
o
C
Automatic system reboot to protect i.MX6QP from damage
Hot
> Max Tj - 15
o
C
i.MX6QP core and GPU frequencies are reduced
Additional actions may be initiated depending on actual system
implementation
Active
< Max Tj - 25
o
C
Limitations applied in Hot mode are removed again
