
Pluto User Manual A4
www.diamondsystems.com
Page
5
1. INTRODUCTION
Pluto is a high performance, highly integrated board-level embedded computer matching the footprint of the
popular ETX computer-on-module (COM) standard.
Pluto
’s CPU core consists of an ETX CPU module mounted on its bottom side, an approach that improves
thermal management and increases the space for I/O functions and connectors. This innovative design has
enabled Pluto to integrate additional serial and Ethernet controllers, a complete set of peripheral interface header
connectors, and a PC/104-
Plus
expansion stack location
– all within the compact ETX footprint.
Thanks to Pluto
’s flexible architecture, you can select from a wide range of ETX-based CPUs to meet each
application’s specific performance, power, and cost requirements. Available processors include the Intel Bay Trail
E3845 CPU and two of the AMD Fusion G-Series CPUs, the T56N and T40N
. What’s more, Pluto’s on-board
PC/104-
Plus
stack location facilitates the addition of custom or off-the-shelf ISA- and PCI-interfaced expansion
modules, helping you satisfy your application
’s precise requirements.
Pluto is offered in a range of models that vary according to the choice of ETX CPU module and on-board SO-
DIMM SDRAM capacity.
Pluto Model
ETX CPU
Module
Processor Type
Processor
Clock
SO-DIMM
DRAM
Operating
Temperature
PLT-T56N-4G
ETX-T56N-01
AMD Fusion G-T56N
1.65GHz
4GB
-20°C to +71°C
PLT-T56N-2G
ETX-T56N-01
AMD Fusion G-T56N
1.65GHz
2GB
-20°C to +71°C
PLT-T40N-4G
ETX-T40N-01
AMD Fusion G-T40N
1.0GHz
4GB
-20°C to +71°C
PLT-T40N-2G
ETX-T40N-01
AMD Fusion G-T40N
1.0GHz
2GB
-20°C to +71°C
PLT-3845XT-8G ETX-3845-01
Intel E3845 quad core
1.91GHz
8GB
-40°C to +85°C
PLT-3845XT-4G ETX-3845-01
Intel E3845 quad core
1.91GHz
4GB
-40°C to +85°C
PLT-3845XT-2G ETX-3845-01
Intel E3845 quad core
1.91GHz
2GB
-40°C to +85°C
Figure 1: Edge View of the Pluto Embedded Platform
Pluto
’s features comprise functions provided by the “Pluto baseboard” (top board in stack shown in Figure 1)
along with functions implemented on the attached ETX computer-on-module (COM) macrocomponent (bottom
board in stack), along with a heat-spreader (or heatsink) mounted on the bottom.